Optical Sensors - Photoelectric, Industrial

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M18-4VNDL-Q8

M18-4VNDL-Q8

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M18-4 SERIES: STAINLESS: DIFFUSE

4

QS30ELVCQ

QS30ELVCQ

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PHOTO SEN CLEAR 100MM-2M BIPOLAR

3

Q12AB6FF15

Q12AB6FF15

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PHOTO SEN 15MM LO BIPOLAR

46

S18-2VPDL-Q8

S18-2VPDL-Q8

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PHOTO SEN REFLECT 750MM PNP

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MAHR51A

MAHR51A

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HIGH-RES. MINI-ARRAY RECEIVER: 1

2

PBT26UHT2

PBT26UHT2

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PLASTIC FIBER, DIFFUSE REFLECTIV

5

T186EQ

T186EQ

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EZ-BEAM EMITTER 20M

24

QM42VP6AF150

QM42VP6AF150

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QM42 SERIES:ADJUSTABLE FIELD

2

QS186LE10Q8

QS186LE10Q8

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WORLD-BEAM QS18 SERIES: LASER CL

2

S18SN6R

S18SN6R

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PHOTO SEN RECEIVER 20M NPN

26

T30SP6FF100Q

T30SP6FF100Q

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EZ-BEAM T30 SERIES FIXED FIELD<B

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SME312LPCQDP

SME312LPCQDP

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SME312LPCQDP 5PIN EURO PIGTAIL P

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TM18AP6FF50Q8

TM18AP6FF50Q8

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EZ BEAM TM18: FIXED FIELD BACKGR

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SM312DQDP

SM312DQDP

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PHOTO SEN DIFFUSED 380MM BIPOLAR

10

Q60BB6LAF2000Q

Q60BB6LAF2000Q

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SEN LASER 200-2000MM BIPOLAR

59

DS186EQ5

DS186EQ5

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DS186EQ5 EURO QP EMITTER

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QCM50-K3D60-Q8-5

QCM50-K3D60-Q8-5

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SEN CLR 20-150MM PNP/NPN-IO LINK

2

T18-2VNFF30IR-Q8

T18-2VNFF30IR-Q8

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T18-2 IR 30MM NPN M12 4PIN

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S18SN6RQDP

S18SN6RQDP

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S18SN6RQDP NPN DC RECEIVER 4-PIN

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K50RPLPGREQ

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K50 E-SERIES EZ-LIGHT: 2-COLOR P

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Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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