Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
HTE18-V4A1BB

HTE18-V4A1BB

SICK

SENSOR PROXIMITY 1M PNP

0

HL18G-N4A3BM

HL18G-N4A3BM

SICK

SENSOR RETROREFLECTIVE 3M NPN

0

WL4-3P1430

WL4-3P1430

SICK

SENSOR RETROREFLECTIVE 4.5M PNP

0

WL9M4-3N1132

WL9M4-3N1132

SICK

SENSOR RETROREFLECTIVE 5M NPN

0

WL4S-3P1330V

WL4S-3P1330V

SICK

SENSOR RETROREFLECTIVE 4M PNP

0

WTB4S-3F2162V

WTB4S-3F2162V

SICK

SENSOR PROXIMITY 500MM PNP

0

WL4SLG-3P3232H

WL4SLG-3P3232H

SICK

SENSOR RETROREFLECTIVE 4.5M PNP

0

WT27L-2S930A01

WT27L-2S930A01

SICK

SENSOR PROXIMITY 800MM RELAY

0

HL18G-N1G3BL

HL18G-N1G3BL

SICK

SENSOR RETROREFLECTIVE 3M NPN

0

ET4-F4238

ET4-F4238

SICK

SENSOR PROXIMITY 100MM PNP

0

GTE6-P7211

GTE6-P7211

SICK

SENSOR PROXIMITY 300MM PNP

0

GRSE18-N2447

GRSE18-N2447

SICK

SENSOR THROUGH-BEAM 10M NPN

0

GRSE18S-N1147

GRSE18S-N1147

SICK

SENSOR THROUGH-BEAM 15M NPN

0

ZT2-E2215

ZT2-E2215

SICK

SENSOR PROXIMITY 60MM NPN

0

HSE18-A4A1AA

HSE18-A4A1AA

SICK

SENSOR THROUGH-BEAM 20M NPN/PNP

0

GRTE18S-F2349

GRTE18S-F2349

SICK

SENSOR PROXIMITY 550MM PNP

0

WLG4-3P1482

WLG4-3P1482

SICK

SENSOR RETROREFLECTIVE 900MM PNP

0

ZT2-E4231

ZT2-E4231

SICK

SENSOR PROXIMITY 100MM NPN

0

GRTE18S-P2447

GRTE18S-P2447

SICK

SENSOR PROXIMITY 550MM PNP

0

HSE18-P4B1BA

HSE18-P4B1BA

SICK

SENSOR THROUGH-BEAM 20M PNP

0

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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