Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
ET3-F5215

ET3-F5215

SICK

SENSOR PROXIMITY 155MM PNP

0

WSE4S-3F3130

WSE4S-3F3130

SICK

SENSOR THRU-BEAM 10MM NPN DO/LO

0

KT5W-2P1316

KT5W-2P1316

SICK

SENSOR CONT 40MM PNP

0

HL18-A2C3BE

HL18-A2C3BE

SICK

SENSOR RETROREFLECTIVE 6.5M PNP

0

WTB4SC-3P2262A71

WTB4SC-3P2262A71

SICK

SENSOR PROXIMITY 180MM PNP

0

WL9M4G-3P1132

WL9M4G-3P1132

SICK

SENSOR RETROREFLECTIVE 3M PNP

0

WSE4S-3P1430V

WSE4S-3P1430V

SICK

SENSOR THROUGH-BEAM 5M PNP

0

WSE4T-3F1430

WSE4T-3F1430

SICK

SENSOR THROUGH-BEAM 2.5M PNP

0

HL18-P3A3BD

HL18-P3A3BD

SICK

SENSOR RETROREFLECTIVE 6.5M PNP

0

KT5G-2N3151

KT5G-2N3151

SICK

SENSOR 10MM NPN ANALOG LGHT SPOT

0

HTE18-B4B1BH

HTE18-B4B1BH

SICK

SENSOR PROXIMITY 1M NPN/PNP

0

HL18-P4A3BG

HL18-P4A3BG

SICK

SENSOR RETROREFLECTIVE 6.5M PNP

0

GRL18S-P233W

GRL18S-P233W

SICK

SENSOR RETROREFLECTIVE 7.2M PNP

0

WSE27-3F2631

WSE27-3F2631

SICK

SENSOR THROUGH-BEAM 25M PNP

0

WTB4-3P3162S04

WTB4-3P3162S04

SICK

SENSOR PROXIMITY 150MM PNP

0

ET3-P5228

ET3-P5228

SICK

SENSOR PROXIMITY 155MM PNP

0

WL4-3F3130

WL4-3F3130

SICK

SENSOR RETROREFLECTIVE 4.5M PNP

0

WL12L-2B530A01

WL12L-2B530A01

SICK

SENSOR RETROREFLECTV 18M NPN/PNP

0

EL4-F2428

EL4-F2428

SICK

SENSOR RETROREFLECTIVE 4.8M PNP

0

WTB4S-3P3131

WTB4S-3P3131

SICK

SENSOR PROXIMITY 120MM PNP

0

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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