Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
PXLS83733AESR2

PXLS83733AESR2

NXP Semiconductors

2 AXIS HI/HI YZ

0

PXLS60333AESR2

PXLS60333AESR2

NXP Semiconductors

XTRINSIC 2 AXIS HIGH/HIGH XY ACC

0

PXLS70620AESR2

PXLS70620AESR2

NXP Semiconductors

MED Y 1 AXIS ACCELEROMETER

0

PXLS82722AESR2

PXLS82722AESR2

NXP Semiconductors

2 AXIS MED/MED YZ

0

PXLS60130AES

PXLS60130AES

NXP Semiconductors

XTRINSIC 1 AXIS ACCELEROMETER

0

PXLS60333AES

PXLS60333AES

NXP Semiconductors

XTRINSIC 2 AXIS HIGH/HIGH XY ACC

0

PXLS83333AESR2

PXLS83333AESR2

NXP Semiconductors

2 AXIS HI/HI XY

0

MMA2612KGCWR2

MMA2612KGCWR2

NXP Semiconductors

ACCELEROMETER 125G PCM 16QFN

0

PXLS84422AESR2

PXLS84422AESR2

NXP Semiconductors

2 AXIS MED/MED XZ

0

FXTH87EH226T1

FXTH87EH226T1

NXP Semiconductors

TPMS E 7X7 900KPA X&Z AXIS

0

PXLS80333AESR2

PXLS80333AESR2

NXP Semiconductors

2 AXIS HI/HI XY

0

PXLS82422AESR2

PXLS82422AESR2

NXP Semiconductors

2 AXIS MED/MED XZ

0

PXLS64422AESR2

PXLS64422AESR2

NXP Semiconductors

XTRINSIC 2 AXIS MED/MED XZ ACCEL

0

PXLS70620AES

PXLS70620AES

NXP Semiconductors

MED Y 1 AXIS ACCELEROMETER

0

PXLS81733AESR2

PXLS81733AESR2

NXP Semiconductors

2 AXIS HI/HI YZ

0

PXLS70630AES

PXLS70630AES

NXP Semiconductors

HIGH Y 1 AXIS ACCELEROMETER

0

FXLS8965AFR1

FXLS8965AFR1

NXP Semiconductors

1AXIS 2/4/8/16G 2X2DFN10

0

PXLS63322AESR2

PXLS63322AESR2

NXP Semiconductors

XTRINSIC 2 AXIS MED/MED XY ACCEL

0

PXLS81722AESR2

PXLS81722AESR2

NXP Semiconductors

2 AXIS MED/MED YZ

0

MMA5112LCWR2

MMA5112LCWR2

NXP Semiconductors

ACCELEROMETER 120G PCM/SPI 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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