Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA2240KEG574

MMA2240KEG574

NXP Semiconductors

SURFACE MOUNT MICROMACHINED ACCE

0

MMA8125EGR2

MMA8125EGR2

NXP Semiconductors

ACCEL 250G DSI/SPI 16SOIC

0

MMA7360L

MMA7360L

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA7360LT

MMA7360LT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

AD22281-R2

AD22281-R2

Analog Devices, Inc.

ACCELEROMETER 70G ANALOG 8CLCC

0

AD22280-R2

AD22280-R2

Analog Devices, Inc.

ACCELEROMETER 50G ANALOG 8CLCC

0

MMA7456LR1

MMA7456LR1

NXP Semiconductors

ACCELEROMETER 2-8G I2C/SPI 14LGA

0

MMA8450QR1

MMA8450QR1

NXP Semiconductors

ACCELEROMETER 2-8G I2C 16QFN

0

MMA3201D

MMA3201D

NXP Semiconductors

ACCELEROMETER 45G ANALOG 20SOIC

0

3255-100

3255-100

TE Connectivity Measurement Specialties

ACCELEROMETER 100G ANALOG

0

AD22279-A-R2

AD22279-A-R2

Analog Devices, Inc.

ACCELEROMETER 35G ANALOG 8CLCC

0

MMA6855BKCWR2

MMA6855BKCWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA621010AEGR2

MMA621010AEGR2

NXP Semiconductors

ACCELEROMETER 100G ANALOG 20SOIC

0

MMA6851BKCWR2

MMA6851BKCWR2

NXP Semiconductors

ACCELEROMETER 25G SPI 16QFN

0

MMA1260D

MMA1260D

NXP Semiconductors

ACCELEROMETER 1.5G ANALOG 16SOIC

0

SCA3000-E05

SCA3000-E05

TOKO / Murata

ACCELEROMETER 18G SPI 18SMD

0

MMA8110EG

MMA8110EG

NXP Semiconductors

ACCEL 100G DSI/SPI 16SOIC

0

LIS3DETR

LIS3DETR

STMicroelectronics

ACCEL 2-16G I2C/SPI 16LGA

0

LIS302DLH

LIS302DLH

STMicroelectronics

ACCELEROMETER 2-8G I2C/SPI 14LGA

0

MMA6233QR2

MMA6233QR2

NXP Semiconductors

ACCELEROMETER 10G ANALOG 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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