| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Allegro MicroSystems |
MAGNETIC HALL SWITCH SOT23 |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR LINEAR HALL EFFECT |
0 |
|
|
Honeywell Sensing and Productivity Solutions |
SENSOR HALL EFFECT ANALOG MODULE |
0 |
|
|
Allegro MicroSystems |
SENSOR HALL EFFECT SPI |
0 |
|
|
IR (Infineon Technologies) |
IC SPEED SENSOR MAGN PG-SSO-3 |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
MAGNETORESISTIVE ELEMENT |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
MAGNETORESISTIVE ELEMENT |
0 |
|
|
IR (Infineon Technologies) |
SENSOR MAGNETORESISTIVE PWM 3SIP |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR LINEAR HALL EFFECT |
0 |
|
|
MEMSIC |
MAGNETIC SENSOR 3-AXIS |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR LINEAR HALL EFFECT |
0 |
|
|
MEMSIC |
MAGNETIC SENSOR 3-AXIS |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR ELECTRONIC COMPASS WLCSP |
0 |
|
|
Kübler, Inc. |
INCREMENTAL MAGNETIC SESNOR |
0 |
|
|
Honeywell Aerospace |
SENSOR MR I2C 14LCC |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
MAGNETORESISTIVE ELEMENT |
0 |
|
|
Maxim Integrated |
AUTOMOTIVE QUAD 2-WIRE HALL EFFE |
0 |
|
|
IR (Infineon Technologies) |
IC SPEED SENSOR MAGN PG-SSO-2 |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR HALL EFFECT ANALOG 4SMD |
0 |
|
|
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR HALL EFFECT I2C 16QFN |
0 |
|
Magnetic sensors - linear compass ICs are semiconductor devices that detect magnetic fields and convert them into electrical signals. These integrated circuits provide precise measurement of magnetic field direction and strength in linear axes, enabling 2D/3D orientation detection. Their importance spans multiple industries due to their ability to provide contactless position sensing, navigation capabilities, and magnetic field monitoring in compact form factors.
| Type | Functional Features | Application Examples |
|---|---|---|
| Hall Effect Sensors | Voltage output proportional to magnetic field strength, simple design | Current sensing, proximity detection |
| Anisotropic Magnetoresistance (AMR) Sensors | High sensitivity (0.1 accuracy), low power consumption | Electronic compasses, navigation systems |
| Giant Magnetoresistance (GMR) Sensors | Ultra-high sensitivity (nanotesla range), wide bandwidth | Biomedical devices, industrial position control |
| Tunneling Magnetoresistance (TMR) Sensors | Lowest power consumption, excellent thermal stability | IoT devices, automotive safety systems |
Typical construction includes: - Sensing element (Hall plate/AMR film/TMR junction) - Signal conditioning circuitry (amplifiers, ADCs) - Temperature compensation modules - Digital interface (I2C/SPI) Packaged in LGA/QFN formats (2-8mm sizes) with magnetic shielding layers. Advanced versions integrate sensor fusion algorithms for 3-axis measurement.
| Parameter | Description & Importance |
|---|---|
| Sensitivity (mV/Gauss) | Determines minimum detectable field strength |
| Resolution ( T/LSB) | Affects angle measurement precision (critical for navigation) |
| Operating Temperature (-40 to +125 C) | Defines environmental suitability |
| Power Consumption ( A/mA) | Crucial for battery-powered devices |
| Interface Type | I2C/SPI for digital output, analog for raw signals |
Main industries include: - Consumer Electronics: Smartphone compasses, AR/VR headsets - Automotive: EPS systems, vehicle detection - Industrial: Robotics, CNC machine tool positioning - Aerospace: Drone stabilization systems - Medical: Surgical tool tracking
| Manufacturer | Product Series | Key Specifications |
|---|---|---|
| STMicroelectronics | LIS3MDL | 50 Gauss range, 0.08 T/LSB, I2C/SPI |
| Honeywell | HMC5883L | 80 Hz bandwidth, 2-4 Gauss accuracy |
| NXP Semiconductors | MFX7755 | 3D sensing, 0.1 heading accuracy |
| TDK-InvenSense | ICM-20948 | 9-axis MEMS+mag, 0.15 mA operating current |
Key consideration factors: - Required measurement axis (2D vs 3D) - Environmental conditions (temperature, vibration) - Power budget constraints - Required accuracy vs cost trade-offs - Interface compatibility with host system - Calibration requirements (hard/soft iron compensation)
Current development directions: - Integration with MEMS IMUs for sensor fusion - AI-based self-calibration algorithms - Sub-10 A ultra-low power consumption - Increased radiation hardness for space applications - Development of 4D magnetic field-time sensors