Force Sensors

Image Part Number Description / PDF Quantity Rfq
114990100

114990100

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WEIGHT SENSOR (LOAD CELL) 0-50KG

126

314990000

314990000

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WEIGHT SENSOR (LOAD CELL) 0-500G

20

314030003

314030003

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LOAD SENSOR

0

114990097

114990097

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WEIGHT SENSOR (LOAD CELL) 0-20KG

0

114990107

114990107

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0.2" THIN FILM RES PRESSURE SNSR

0

114990096

114990096

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WEIGHT SENSOR (LOAD CELL) 0-10KG

0

114990094

114990094

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WEIGHT SENSOR (LOAD CELL) 0-5KG

0

114990093

114990093

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WEIGHT SENSOR (LOAD CELL) 0-3KG

0

114990103

114990103

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WEIGHT SENSOR (LOAD CELL) 0-350K

0

114990098

114990098

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WEIGHT SENSOR (LOAD CELL) 0-30KG

0

114990102

114990102

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WEIGHT SENSOR (LOAD CELL) 0-200K

0

114990105

114990105

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WEIGHT SENSOR (LOAD CELL) 0-800K

0

114990101

114990101

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WEIGHT SENSOR (LOAD CELL) 0-150K

0

114990099

114990099

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WEIGHT SENSOR (LOAD CELL) 0-40KG

0

114990104

114990104

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WEIGHT SENSOR (LOAD CELL) 0-400K

0

114990106

114990106

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2.2 INCH BEND SENSOR A201

0

114990095

114990095

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WEIGHT SENSOR (LOAD CELL) 0-8KG

0

Force Sensors

1. Overview

Force sensors are transducers that convert mechanical force into measurable electrical signals. These devices play a critical role in industrial automation, healthcare, aerospace, and consumer electronics by enabling precise force measurement and control. Modern technological advancements have significantly improved their accuracy, durability, and integration capabilities, making them essential components in smart systems and IoT-enabled devices.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, suitable for static/dynamic measurementsElectronic scales, structural testing
piezoelectricSelf-generating, excellent dynamic responseEngine combustion analysis, impact testing
CapacitiveNon-contact measurement, low power consumptionTouchscreens, robotic grippers
MEMSMiniaturized, mass-producibleSmartphones, wearable devices

3. Structure and Components

Typical force sensors consist of:

  • Sensing element (strain gauges, piezoelectric crystals, or MEMS structures)
  • Signal conditioning circuitry (amplifiers, temperature compensation)
  • Mechanical housing (aluminum/titanium alloys or polymer enclosures)
  • Electrical connectors (IP65-IP68 rated interfaces)
The sensing core is usually protected by protective coatings against environmental factors while maintaining mechanical integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range0.1N to 5000kNDetermines application suitability
Non-linearity Error 0.01% to 1% FSAffects measurement accuracy
Temperature Range-50 C to +200 CEnvironmental adaptability
Output Signal0-5V, 4-20mA, digitalSystem integration compatibility
Overload Capacity150%-500% FSDevice durability

5. Application Fields

Key industries include:

  • Industrial automation (robotic arms, CNC machines)
  • Medical equipment (surgical robots, patient monitors)
  • Automotive testing (crash test sensors, brake systems)
  • Aerospace (wing load monitoring, propulsion systems)
  • Consumer electronics (haptic feedback devices)
Case Study: In automotive crash testing, piezoelectric sensors measure impact forces with 0.5% accuracy at sampling rates up to 1MHz.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
HoneywellPPT0010MEMS-based, 10mN resolution
TE ConnectivityPCB 208CPiezoelectric, 100kHz bandwidth
FutekLLC SeriesSpending beam, IP65 rating
Bosch SensortecBMP580Barometric pressure sensing

7. Selection Guidelines

Key considerations:

  • Required measurement range vs. overload protection needs
  • Environmental conditions (temperature, humidity, vibration)
  • Static vs. dynamic force measurement requirements
  • Signal output compatibility with control systems
  • Mounting constraints and mechanical interface specifications
Recommendation: For robotics applications, prioritize MEMS sensors with integrated temperature compensation and digital interfaces.

8. Industry Trends

Future developments include:

  • Miniaturization through advanced MEMS fabrication
  • Wireless sensing nodes for IoT integration
  • AI-enhanced signal processing algorithms
  • Multi-axis force sensing capabilities
  • Self-powered energy harvesting designs
Market growth projections indicate a CAGR of 6.8% from 2023-2030, driven by automation and smart device adoption.

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