| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Allied Vision |
CAMERA 1800 U-1240M MONO S-MOUNT |
1 |
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Allied Vision |
CAMERA MONO S-MOUNT OPEN |
0 |
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Allied Vision |
CAMERA COLOR S-MOUNT OPEN AR0521 |
0 |
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Allied Vision |
CAMERA MONO CS-MOUNT OPEN |
0 |
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Allied Vision |
CAMERA 1800 C-2050M MONO C-MOUNT |
3 |
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Allied Vision |
CAMERA 1800 U-1240C COLOR BAREBO |
0 |
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Allied Vision |
CAMERA MONO NIR CS-MOUNT USB90 |
0 |
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Allied Vision |
CAMERA MONO C-MNT OPEN AR0135CS |
0 |
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Allied Vision |
CAMERA MONO C-MOUNT USB90 |
0 |
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Allied Vision |
CAMERA MONO BAREBOARD PYTHON480 |
0 |
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Allied Vision |
CAMERA COLOR SMNT OPEN PYTHON480 |
0 |
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Allied Vision |
CAMERA MONO CS-MOUNT OPEN AR0521 |
0 |
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Allied Vision |
CAMERA COLOR C-MOUNT OPEN USB90 |
0 |
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Allied Vision |
CAMERA COLOR C-MOUNT USB90 |
0 |
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Allied Vision |
CAMERA MONO BAREBOARD |
0 |
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Allied Vision |
CAMERA MONO BAREBOARD |
1 |
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Allied Vision |
CAMERA MONO S-MOUNT PYTHON480 |
0 |
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Allied Vision |
CAMERA MONO C-MOUNT OPEN |
0 |
|
 |
Allied Vision |
CAMERA COLOR C-MOUNT OPEN AR0135 |
0 |
|
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Allied Vision |
CAMERA MONO CS-MOUNT OPEN |
0 |
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Camera modules are integrated optoelectronic devices that convert optical images into digital signals. As critical components in sensors and transducers systems, they combine image sensors, lenses, and signal processing circuits to enable visual data acquisition in modern electronics. Their miniaturization, high performance, and cost-effectiveness have driven advancements in automation, healthcare, security, and consumer electronics.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| CMOS Image Sensors | Low power consumption, high integration, cost-effective | Smartphones, webcams |
| CCD Sensors | Superior image quality, high light sensitivity | Industrial inspection, astronomy |
| Infrared Cameras | Capture non-visible infrared spectrum | Night vision, thermal monitoring |
| 3D Depth Sensors | Generate spatial depth information | AR/VR, robotics |
| Global Shutter Modules | Eliminate motion distortion | High-speed industrial imaging |
| Low-light Cameras | Enhanced sensitivity in dark environments | Surveillance, autonomous vehicles |
A typical camera module consists of: - Optical Lens System: Focuses light onto the sensor - Image Sensor (CMOS/CCD): Converts photons to electrical signals - Image Signal Processor (ISP): Performs color correction and noise reduction - Interface Circuitry: Supports data transmission (MIPI, USB, etc.) - Mechanical Housing: Protects components and ensures optical alignment Advanced modules may integrate autofocus actuators, IR filters, or AI acceleration cores.
| Parameter | Description | Importance |
|---|---|---|
| Resolution | Pixel count (e.g., 1920 1080) | Determines image detail level |
| Frame Rate | Images per second (fps) | Critical for motion capture |
| Sensor Size | Physical dimensions (inches) | Affects light gathering capability |
| Dynamic Range | Light-to-dark ratio (dB) | Measures detail retention in extremes |
| Signal-to-Noise Ratio | Image clarity vs. noise | Impacts low-light performance |
| Interface Type | MIPI CSI-2, USB 3.0, etc. | Dictates system compatibility |
| Power Consumption | Operating current (mA) | Battery life consideration |
| Operating Temperature | Functional range ( C) | Environment suitability |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Sony Semiconductor | IMX586 | 48MP CMOS sensor with 0.8 m pixels |
| onsemi | AR0234CS | 2.3MP automotive image sensor |
| Microsoft | Kinect Azure | 3D depth sensing with time-of-flight |
| Intel RealSense | D455 | HD depth camera with RGB sensor |
| Himax Technologies | HX-6320 | Low-power driver IC for camera modules |
Key considerations include: - Match resolution/frame rate to application needs - Evaluate environmental requirements (temperature, vibration) - Verify interface compatibility with host system - Balance cost with required image quality - Assess long-term supply stability - Consider additional features (autofocus, EIS support) - Test under actual lighting conditions
Emerging trends include: - Stacked CMOS sensors with AI processing cores - Multi-spectral imaging integration - Event-based vision sensors with microsecond response - Wafer-level optics for further miniaturization - Increased adoption of computational photography - Automotive-grade modules with ASIL-D functional safety