| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Dataforth |
SIGNAL CONDITIONER TRUE RMS DIN |
0 |
|
 |
Sensata Technologies – BEI Sensors |
BROADCASTER WITH OPTICAL ISOLATO |
23 |
|
 |
Dataforth |
SENSOR-TO-COMPUTER MOD. (FREQ) |
3 |
|
 |
Dataforth |
ANALOG V-INPUT MODULE WIDE BW |
2 |
|
 |
Dataforth |
ISOL LINEARIZED THERMOCOUPLE MOD |
0 |
|
 |
Dataforth |
NON-LINEARIZED THERMOCOUPLE MOD |
0 |
|
 |
Dataforth |
LINEARIZED THERMOCOUPLE MODULE |
23 |
|
 |
Dataforth |
VOLTAGE INPUT MODULES, NARROW BW |
7 |
|
 |
Panasonic |
DIGITAL LASER AMP CONN TYPE NPN |
0 |
|
 |
Dataforth |
ISOL LINEARIZED THERMOCOUPLE MOD |
4 |
|
 |
Dataforth |
VOLTAGE IN MODULE WIDE BW DIN |
0 |
|
 |
Dataforth |
SIGNAL CONDITIONER V-IN DIN RAIL |
7 |
|
 |
Dataforth |
ISOLATED ANALOG V-INPUT MODULE |
15 |
|
 |
Dataforth |
GENERAL PURP. SIGNAL CONDITIONER |
0 |
|
 |
Dataforth |
VOLTAGE OUTPUT MODULE |
28 |
|
 |
Dataforth |
VOLTAGE INPUT MODULE, NARROW BW |
1 |
|
 |
Dataforth |
STRAIN GAGE MODULE NARROW WB |
5 |
|
 |
Dataforth |
ISOL LINEARIZED THERMOCOUPLE MOD |
0 |
|
 |
Banner Engineering |
DF-G2 RED BEAM SMALL OBJECT COUN |
2 |
|
 |
Banner Engineering |
DF-G2 RED BEAM HIGH SPEED DUAL D |
12 |
|
Amplifiers are electronic devices that increase the amplitude of input signals while maintaining signal integrity. They play a critical role in sensor signal conditioning, transducer output enhancement, and data acquisition systems. Modern applications require amplifiers to handle diverse signal types (analog/digital, voltage/current) with high precision and efficiency in fields like IoT, industrial automation, and medical electronics.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Voltage Amplifiers | High voltage gain, medium input impedance | Audio systems, sensor signal conditioning |
| Current Amplifiers | High current gain, low output impedance | Motor drivers, power systems |
| Transimpedance Amplifiers | Converts current to voltage with precision | Photodiode sensors, optical receivers |
| Instrumentation Amplifiers | Differential input with high CMRR | Medical devices, industrial sensors |
| Power Amplifiers | High output power capability | RF transmitters, audio equipment |
Typical amplifier architecture includes: - Housing: Metal/plastic enclosure for EMI shielding - Circuit Board: Contains operational amplifiers (op-amps), resistors, capacitors - Input/Output Terminals: Screw/banana connectors or PCB pads - Power Supply Circuitry: Voltage regulators and filtering components - Thermal Management: Heat sinks or cooling fans for high-power models Modern IC-based designs integrate multiple stages in single chips with digital calibration features.
| Parameter | Description | Importance |
|---|---|---|
| Gain (dB) | Signal amplification ratio | Determines output strength vs input |
| Bandwidth (Hz) | Frequency range of operation | Affects signal fidelity |
| Input Impedance ( ) | Resistance to input signal source | Prevents signal source loading |
| Output Noise (nV/ Hz) | Unwanted signal generation | Critical for precision measurements |
| Power Supply Rejection Ratio (PSRR) | Noise suppression from power source | Ensures stable operation |
Key industries include: - Industrial Automation: Pressure sensor signal amplification - Medical Equipment: ECG machine signal conditioning - Telecommunications: RF signal boosting - Automotive: Engine control unit (ECU) sensor interfaces - Scientific Instruments: Spectrometer data acquisition
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TI (Texas Instruments) | LMH6629 | 1.5GHz bandwidth, 0.1dB gain flatness |
| Analog Devices | AD8421 | 160dB CMRR, programmable gain |
| STMicroelectronics | TSV991 | 16MHz GBWP, rail-to-rail I/O |
| Maxim Integrated | MAX4468 | Audio amplifier with low THD |
Key considerations: 1. Required gain vs bandwidth trade-off 2. Source/load impedance matching 3. Operating temperature range (-40 C to +125 C typical) 4. Power supply constraints (single/dual rail) 5. Noise tolerance for precision applications 6. Physical size and thermal management needs
Current development directions include: - Integration with ADCs and digital interfaces (e.g., I2C) - Development of MEMS-based amplifiers for IoT - Advancements in Class-D amplifier efficiency (>90%) - AI-driven adaptive amplification algorithms - Photonic integrated circuit amplifiers for 5G+ communications