RFI and EMI - Shielding and Absorbing Materials

Image Part Number Description / PDF Quantity Rfq
64008163

64008163

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X6"

0

24296260

24296260

Laird - Performance Materials

RF ABSORB SHEET 12.008"X12.008"

0

24296257

24296257

Laird - Performance Materials

RF ABSORB SHEET 12.008"X12.008"

0

21443100

21443100

Laird - Performance Materials

RF EMI ABSORBING SHEET 36"X12"

0

857850254R0500

857850254R0500

Laird - Performance Materials

CONDUCTIVE TAPE, 25.4MM X 0.11MM

200

21109180

21109180

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

21109143

21109143

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

CF710AB30483048

CF710AB30483048

Laird - Performance Materials

RF EMI NICU CF PROF 304.79MMSQUA

0

1A1524R0250

1A1524R0250

Laird - Performance Materials

HFR NICU NRS CPSA RL

0

21191323

21191323

Laird - Performance Materials

FGM-40/SS6M A9878

0

21133176

21133176

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

21124377

21124377

Laird - Performance Materials

RF EMI ECCOSORB 12"X0.625"

0

21114176

21114176

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

21142173

21142173

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

21133179

21133179

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

CZ400-080

CZ400-080

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

21148180

21148180

Laird - Performance Materials

RF EMI ABSORBING SHEET 12"X12"

0

8866-LT20NE2191

8866-LT20NE2191

Laird - Performance Materials

8866-0131-130 (HOLLOW D, NI/AL,

1600

8863-LT20NE2186

8863-LT20NE2186

Laird - Performance Materials

8863-0100-130 (SOLID O, NI/AL, L

2000

24296578

24296578

Laird - Performance Materials

BSR-1/SS6M A10894 MADE FROM MFS-

0

RFI and EMI - Shielding and Absorbing Materials

1. Overview

Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are disruptive electromagnetic emissions that affect the performance of electronic devices. Shielding and absorbing materials mitigate these effects by blocking or dissipating electromagnetic energy. These materials are critical in RF/Intermediate Frequency (IF) circuits, RFID systems, and high-frequency electronics to ensure signal integrity, regulatory compliance, and operational reliability.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Metallic Shielding FoilsHigh conductivity, flexible, corrosion-resistant coatingsSmartphone enclosures, RFID tags
Conductive ElastomersElastomeric base with conductive fillers (e.g., silver, nickel)Aerospace connectors, medical devices
EMI Absorbing SheetsFlexible polymer matrices with magnetic particles (e.g., ferrite)5G base stations, radar systems
Conformal CoatingsThin-layer conductive paints or spraysPCB shielding, IoT device casings
Textile-Based ShieldsWoven fabrics with conductive yarns (e.g., silver-coated)Wearable electronics, flexible antennas

3. Structure and Composition

Typical products feature multi-layer architectures:

  • Base Substrate: Polymer films (PET, polyimide) or woven fabrics
  • Conductive Layer: Metal deposits (aluminum, copper) or conductive inks
  • Adhesive Interface: Acrylic or silicone-based adhesives for bonding
  • Protective Coating: Anti-oxidation layers (e.g., nickel-gold plating)
Absorbing materials often embed lossy magnetic particles (ferrite, carbonyl iron) in elastomeric matrices to convert EMI energy into heat.

4. Key Technical Specifications

ParameterDescriptionImportance
Shielding Effectiveness (SE)dB attenuation across 30 MHz 40 GHzDirectly impacts signal-to-noise ratio
Surface Resistivity0.01 100 /sqDetermines DC grounding performance
Relative Permeability1 1000 (absorbing materials)Influences magnetic field absorption
Temperature Stability-55 C to +150 C operational rangeEnsures reliability in harsh environments
Thickness0.05 5.0 mmAffects weight and flexibility

5. Application Areas

Primary industries include:

  • Telecommunications: 5G/6G infrastructure, fiber optic transceivers
  • Automotive: V2X communication modules, ADAS sensors
  • Healthcare: MRI-compatible devices, wireless patient monitors
  • Consumer Electronics: Foldable smartphones, AR/VR headsets
  • Defense: Electronic warfare systems, stealth coatings

6. Leading Manufacturers and Products

ManufacturerProductKey Features
3MScotch 9703LEAnisotropic conductive film for RF shielding
Laird Performance MaterialsHF Absorber 418 40 GHz broadband absorption
Saint-GobainTYGARD TC 1191Transparent conductive film for RFID antennas
Parker ChomericsCHO-SEAL 13350.05 mm thick EMI gasket material

7. Selection Guidelines

Key considerations:

  • Frequency Matching: Align SE performance with target bands (e.g., 2.4 GHz for Bluetooth)
  • Environmental Resistance: Chemical exposure, humidity, and vibration tolerance
  • Form Factor: Thin profiles for portable devices vs. rigid panels for infrastructure
  • Cost-Performance Balance: Silver-filled materials offer superior conductivity but higher cost
Case Study: Automotive radar systems use ferrite-loaded silicones to suppress 76 81 GHz interference while maintaining thermal stability.

8. Industry Trends

Emerging developments include:

  • 2D materials (graphene-enhanced composites) for sub-10 nm shielding layers
  • 4D-printed reconfigurable absorbers with tunable frequency response
  • RoHS-compliant alternatives to traditional heavy metal-based coatings
  • Integration with AI-driven EMI prediction models for optimized design
Market growth is driven by 5G expansion, with projected CAGR of 9.2% (2023 2030) according to Grand View Research.

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