RFI and EMI - Shielding and Absorbing Materials

Image Part Number Description / PDF Quantity Rfq
FFAM151*1T1

FFAM151*1T1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

1

FFAM10 1*1T1

FFAM10 1*1T1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

0

FFAM151*1

FFAM151*1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

5

FFAM0251*1T1

FFAM0251*1T1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

188

FFAM25 1*1

FFAM25 1*1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

0

FFAM201*1T1

FFAM201*1T1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

2

FFAM20-1*1

FFAM20-1*1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

3

FFAM251*1T1

FFAM251*1T1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

33

FFAM06 1*1T1

FFAM06 1*1T1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

0

FFAM10 1*1

FFAM10 1*1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

10

FFAM06-1*1

FFAM06-1*1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

0

FFAM251*1T2

FFAM251*1T2

API Delevan

RF FERRITE SHEET 3.937"X3.937"

0

FFAM253*3

FFAM253*3

API Delevan

RF FERRITE SHEET 11.811"X11.811"

0

FFAM203*3

FFAM203*3

API Delevan

RF FERRITE SHEET 11.811"X11.811"

0

FFAM103*3

FFAM103*3

API Delevan

RF FERRITE SHEET 11.811"X11.811"

0

FFAM251*1

FFAM251*1

API Delevan

RF FERRITE SHEET 3.937"X3.937"

0

FFAM154*4T1

FFAM154*4T1

API Delevan

RF FERRITE SHEET 15.748"X15.748"

0

FFAM153*3T1

FFAM153*3T1

API Delevan

RF FERRITE SHEET 11.811"X11.811"

0

FFAM253*3T2

FFAM253*3T2

API Delevan

RF FERRITE SHEET 11.811"X11.811"

0

FFAM154*4

FFAM154*4

API Delevan

RF FERRITE SHEET 15.748"X15.748"

0

RFI and EMI - Shielding and Absorbing Materials

1. Overview

Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are disruptive electromagnetic emissions that affect the performance of electronic devices. Shielding and absorbing materials mitigate these effects by blocking or dissipating electromagnetic energy. These materials are critical in RF/Intermediate Frequency (IF) circuits, RFID systems, and high-frequency electronics to ensure signal integrity, regulatory compliance, and operational reliability.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Metallic Shielding FoilsHigh conductivity, flexible, corrosion-resistant coatingsSmartphone enclosures, RFID tags
Conductive ElastomersElastomeric base with conductive fillers (e.g., silver, nickel)Aerospace connectors, medical devices
EMI Absorbing SheetsFlexible polymer matrices with magnetic particles (e.g., ferrite)5G base stations, radar systems
Conformal CoatingsThin-layer conductive paints or spraysPCB shielding, IoT device casings
Textile-Based ShieldsWoven fabrics with conductive yarns (e.g., silver-coated)Wearable electronics, flexible antennas

3. Structure and Composition

Typical products feature multi-layer architectures:

  • Base Substrate: Polymer films (PET, polyimide) or woven fabrics
  • Conductive Layer: Metal deposits (aluminum, copper) or conductive inks
  • Adhesive Interface: Acrylic or silicone-based adhesives for bonding
  • Protective Coating: Anti-oxidation layers (e.g., nickel-gold plating)
Absorbing materials often embed lossy magnetic particles (ferrite, carbonyl iron) in elastomeric matrices to convert EMI energy into heat.

4. Key Technical Specifications

ParameterDescriptionImportance
Shielding Effectiveness (SE)dB attenuation across 30 MHz 40 GHzDirectly impacts signal-to-noise ratio
Surface Resistivity0.01 100 /sqDetermines DC grounding performance
Relative Permeability1 1000 (absorbing materials)Influences magnetic field absorption
Temperature Stability-55 C to +150 C operational rangeEnsures reliability in harsh environments
Thickness0.05 5.0 mmAffects weight and flexibility

5. Application Areas

Primary industries include:

  • Telecommunications: 5G/6G infrastructure, fiber optic transceivers
  • Automotive: V2X communication modules, ADAS sensors
  • Healthcare: MRI-compatible devices, wireless patient monitors
  • Consumer Electronics: Foldable smartphones, AR/VR headsets
  • Defense: Electronic warfare systems, stealth coatings

6. Leading Manufacturers and Products

ManufacturerProductKey Features
3MScotch 9703LEAnisotropic conductive film for RF shielding
Laird Performance MaterialsHF Absorber 418 40 GHz broadband absorption
Saint-GobainTYGARD TC 1191Transparent conductive film for RFID antennas
Parker ChomericsCHO-SEAL 13350.05 mm thick EMI gasket material

7. Selection Guidelines

Key considerations:

  • Frequency Matching: Align SE performance with target bands (e.g., 2.4 GHz for Bluetooth)
  • Environmental Resistance: Chemical exposure, humidity, and vibration tolerance
  • Form Factor: Thin profiles for portable devices vs. rigid panels for infrastructure
  • Cost-Performance Balance: Silver-filled materials offer superior conductivity but higher cost
Case Study: Automotive radar systems use ferrite-loaded silicones to suppress 76 81 GHz interference while maintaining thermal stability.

8. Industry Trends

Emerging developments include:

  • 2D materials (graphene-enhanced composites) for sub-10 nm shielding layers
  • 4D-printed reconfigurable absorbers with tunable frequency response
  • RoHS-compliant alternatives to traditional heavy metal-based coatings
  • Integration with AI-driven EMI prediction models for optimized design
Market growth is driven by 5G expansion, with projected CAGR of 9.2% (2023 2030) according to Grand View Research.

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