RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
080R400-024000

080R400-024000

Orbel

GASKET FABRIC FOAM RECTANGULAR 0

200

24B09-BFA016000T

24B09-BFA016000T

Orbel

FINGER STOCK BECU ADHESIVE MOUNT

87

26B02-BFA018000T

26B02-BFA018000T

Orbel

FINGER STOCK BECU NO SNAG 0.130"

61

100R375-024000

100R375-024000

Orbel

GASKET FABRIC FOAM RECTANGULAR 0

100

26B06-BFA018000T

26B06-BFA018000T

Orbel

FINGER STOCK BECU NO SNAG 0.120"

91

21B03-BFA000543N

21B03-BFA000543N

Orbel

FINGER STOCK BECU SLOT-MOUNT 0.1

99

30B09-BFA024000T

30B09-BFA024000T

Orbel

FINGER STOCK BECU TWIST SERIES S

100

24B13-BFA024000T

24B13-BFA024000T

Orbel

FINGER STOCK BECU ADHESIVE MOUNT

99

30M03-BFA024000T

30M03-BFA024000T

Orbel

FINGER STOCK BECU TWIST SERIES S

95

060D250-024000

060D250-024000

Orbel

GASKET FABRIC FOAM D-SHAPED 0.06

100

060R394-024000

060R394-024000

Orbel

GASKET FABRIC FOAM RECTANGULAR 0

100

21B03-BFA000356N

21B03-BFA000356N

Orbel

FINGER STOCK BECU SLOT-MOUNT 0.1

100

24B19-BFA024000T

24B19-BFA024000T

Orbel

FINGER STOCK BECU ADHESIVE MOUNT

88

32M05-BFA016000N

32M05-BFA016000N

Orbel

FINGER STOCK BECU CLIP-ON PRO 0.

95

093S093-024000

093S093-024000

Orbel

GASKET FABRIC FOAM SQUARE 0.093"

93

080B315-024000

080B315-024000

Orbel

GASKET FABRIC FOAM BELL SHAPED 0

98

30B03-BFA024000T

30B03-BFA024000T

Orbel

FINGER STOCK BECU TWIST SERIES S

11

30B19-BFA024000T

30B19-BFA024000T

Orbel

FINGER STOCK BECU TWIST SERIES S

74

120D150-024000

120D150-024000

Orbel

GASKET FABRIC FOAM D SHAPED 0.12

159

040R510-024000

040R510-024000

Orbel

GASKET FABRIC FOAM RECTANGULAR 0

99

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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