RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4053PA51G01800

4053PA51G01800

Laird - Performance Materials

GSKT FAB/FOAM 2.3X457.2MM DSHAPE

114

0097011002

0097011002

Laird - Performance Materials

FINGERSTOCK BECU 19.6X406.4MM

0

0077005615

0077005615

Laird - Performance Materials

FINGERSTOCK BECU 8.1X406.4MM

0

4522PA51H01800

4522PA51H01800

Laird - Performance Materials

GASKET FABRIC/FOAM 4X457.2MM SQ

667

0097055502

0097055502

Laird - Performance Materials

FINGRSTOCK BECU ALY 8.64X609.6MM

0

0097063002

0097063002

Laird - Performance Materials

FINGERSTOCK BECU 15.24X406.4MM

0

CF710EA02541049

CF710EA02541049

Laird - Performance Materials

GK, NICU,CF,V0 1X25.4X104.9MM

4

0077006202

0077006202

Laird - Performance Materials

GASKET BECU 8.1X4.27MM

0

4548PA51G01800

4548PA51G01800

Laird - Performance Materials

GSKT FAB/FOAM 6.4X457.2MM DSHAPE

0

4120PA51H01800

4120PA51H01800

Laird - Performance Materials

D-SHAPE

0

0077001702

0077001702

Laird - Performance Materials

GASKET BECU 8.1X9.04MM

522

0097056702

0097056702

Laird - Performance Materials

FINGERSTOCK BECU 18.29X609.6MM

0

0077009702

0077009702

Laird - Performance Materials

GASKET BECU 15.24X406.4MM

0

0097055802

0097055802

Laird - Performance Materials

FINGERSTOCK BECU 2.79X609.6MM

0

0097064502

0097064502

Laird - Performance Materials

FINGERSTCK BECU ALY 5.33X609.6MM

456

0097013502

0097013502

Laird - Performance Materials

FINGERSTOCK BECU 7.11X406.4MM

465

0097091602

0097091602

Laird - Performance Materials

FINGERSTOCK BECU 11.43X381MM

0

4060PA51G01800

4060PA51G01800

Laird - Performance Materials

D-SHAPE

16

4184PA51G01800

4184PA51G01800

Laird - Performance Materials

GASKT FAB/FOAM 3.8X457.2MM DSHAP

0

LT18CJ1920

LT18CJ1920

Laird - Performance Materials

VSLMT,STR,SNB,USFT,CTL 0.11*0.32

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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