RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
0098055801

0098055801

Laird - Performance Materials

TWT,STR,BF,USFT

0

4046AB51K01417

4046AB51K01417

Laird - Performance Materials

GASKET FABRIC/FOAM 3X360MM SQ

0

0097072317

0097072317

Laird - Performance Materials

DINC,SNB

0

0077001509

0077001509

Laird - Performance Materials

SLMT,1F,NID

0

4239PA51H02500

4239PA51H02500

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

0097200400

0097200400

Laird - Performance Materials

FINGERSTOCK BECU

0

4H03EB51H01525

4H03EB51H01525

Laird - Performance Materials

IO NICU PTAFG PU V0 REC

0

0078004317

0078004317

Laird - Performance Materials

NOSG,STR,SNB,USFT,PSA

0

0098055106

0098055106

Laird - Performance Materials

TWT,STR,CDC,USFT,PSA .030X.160X.

0

4220PA51H01200

4220PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

67SLH050050025PI00

67SLH050050025PI00

Laird - Performance Materials

METAL FILM OVER FOAM CONTACTS

0

4522AB51K00295

4522AB51K00295

Laird - Performance Materials

GK NICU NRS PU V0 SQ

0

0077001408

0077001408

Laird - Performance Materials

NOSG,STR,SNSAT,PSA

0

4701PA51H09600

4701PA51H09600

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4701PA51H01200

4701PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4688AB51K09600

4688AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 OVL

0

4105PA51H08400

4105PA51H08400

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

0097097317

0097097317

Laird - Performance Materials

CGCLIP,SNB,CLO

0

4228PA51G01200

4228PA51G01200

Laird - Performance Materials

GK,NICU,NRSG,PU,V0,DSH .150X.150

0

4173AB51K01200

4173AB51K01200

Laird - Performance Materials

GK,NICU,NRS,PU,V0,REC .413X.512X

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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