RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
0097072802

0097072802

Laird - Performance Materials

GASKET BECU 15.88X11.35MM

0

26B02-BFA018000T

26B02-BFA018000T

Orbel

FINGER STOCK BECU NO SNAG 0.130"

61

4229PA51H01800

4229PA51H01800

Laird - Performance Materials

GASKT FAB/FOAM 9.7X457.2MM DBL D

0

0097054102

0097054102

Laird - Performance Materials

GASKET BECU 9.65X406.4MM

0

WS-3120-KR-2400

WS-3120-KR-2400

3G Shielding Specialties

FAB/FOAM GASKET .200WX.040HX24L

66

5401-0009-20-300

5401-0009-20-300

Leader Tech Inc.

M83528/001B009, AG/AL FILLED SIL

1

07-0202-0094

07-0202-0094

Parker Chomerics

POLA SPONGE STRIP 11'X0.5X0.125"

19

3437001800

3437001800

Laird - Performance Materials

BLS,9720,ASY,SNB,LP

0

4584PA51H01800

4584PA51H01800

Laird - Performance Materials

GSKT FAB/FOAM 3.8X457.2MM DSHAPE

80

5409-0006-40-300

5409-0006-40-300

Leader Tech Inc.

M83528/009D006, AG/AL FILLED FLO

0

0077004502

0077004502

Laird - Performance Materials

GASKET BECU 8.1X4.27MM

0

10104319-009RLF

10104319-009RLF

Storage & Server IO (Amphenol ICC)

2.50MM HEIGHT UNIVERSAL CONTACT

43363

0077004602

0077004602

Laird - Performance Materials

GASKET BECU 8.1X9.04MM

0

0098054202

0098054202

Laird - Performance Materials

FINGERSTCK ULTRASFT 6.35X406.4MM

0

38401002

38401002

Würth Elektronik Midcom

WE-EGS EMI ELASTOMER GASKET

5

0097055902

0097055902

Laird - Performance Materials

FINGRSTOCK BECU ALY 7.57X609.6MM

49

0097091202

0097091202

Laird - Performance Materials

S3 STR BF PSA

0

0097061502

0097061502

Laird - Performance Materials

FINGERSTOCK BECU 7.57X406.4MM

158

0097053502

0097053502

Laird - Performance Materials

GASKET BECU 19.81X304.8MM

0

S0921-46R

S0921-46R

Harwin

RFI SHIELD CLIP CORNER TIN SMD

1986

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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