RFI and EMI - Contacts, Fingerstock and Gaskets

Part Number	Description / PDF	Quantity
303085035 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	0
0097063302 Laird - Performance Materials	FINGERSTOCK BECU 15.24X406.4MM	0
38401202 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	4
38401001 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	5
4058PA01G01800 Laird - Performance Materials	RECTANGLE	0
4695PA51H01800 Laird - Performance Materials	GASKT FABRIC/FOAM 9.5X457.2MM SQ	650
0C98055902 Laird - Performance Materials	RFI EMI GROUNDING MATERIAL 25FT	0
3021030 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	9
WS-3420-KP-2400 3G Shielding Specialties	FAB/FOAM GASKET .520WX.130HX24L	100
3020606 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	70
38401501 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	8
0077003602 Laird - Performance Materials	GASKET BECU 7.87X24.89MM	0
1734303-1 TE Connectivity AMP Connectors	SHIELD FINGER	10107
4242PA51H01800 Laird - Performance Materials	GSKT FAB/FOAM 6.4X457.2MM DSHAPE	615
38401405 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	0
4112PA51H01800 Laird - Performance Materials	D-SHAPE	0
4123PA51G01800 Laird - Performance Materials	D-SHAPE	0
S7261-45R Harwin	RFI SHIELD FINGER AU 1.5MM SMD	7420
S7181-45R Harwin	RFI SHIELD FINGER AU 4.5MM SMD	3999
0077002302 Laird - Performance Materials	GASKET BECU 9.4X5.72MM	0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Contacts	Conductive elements for maintaining electrical connections under compression	RF connectors, PCB grounding pads
Fingerstock	Resilient metal strips with finger-like projections for continuous shielding	Server chassis, military equipment
Gaskets	Conductive elastomers or mesh materials for sealing gaps	Automotive sensors, medical devices

3. Structure and Composition

Typical structures include:

Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	0.1-10 m	Affects signal transmission efficiency
Shielding Effectiveness	60-120 dB (100 MHz-10 GHz)	Determines EMI/RFI attenuation
Compression Force	0.5-5 N/mm	Impacts mechanical durability
Temperature Range	-55 C to +150 C	Defines operational stability

5. Application Fields

Main industries include:

Telecommunications (5G base stations, microwave links)
Automotive (V2X communication systems, radar sensors)
Aerospace (avionics shielding compartments)
Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Parker Chomerics	CHO-SEAL conductive gaskets
Laird Performance Materials	Form-in-Place EMI gaskets
3M	EMI Shielding Tapes 9703/9706
Samtec	RFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

Frequency range of the application (higher frequencies require tighter tolerances)
Environmental conditions (temperature, humidity, chemical exposure)
Material compatibility (avoid galvanic corrosion between mating surfaces)
Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

Miniaturization for 5G mmWave applications
Low-PIM (Passive Intermodulation) material formulations
Multi-functional integration with thermal management
RoHS-compliant plating processes (eliminating hexavalent chromium)