RF Transceiver ICs

Image Part Number Description / PDF Quantity Rfq
DA14697-00000HR2

DA14697-00000HR2

Dialog Semiconductor

MULTI-CORE WIRELESS MCU FOR BLUE

1435

DA14681-01000U22

DA14681-01000U22

Dialog Semiconductor

IC RF TXRX+MCU BLUETOOTH 53UFBGA

6799

DA14531-00000OG2

DA14531-00000OG2

Dialog Semiconductor

BLE 5.1 SOC WITH ARM CORTEX M0+

36814

DA14580-01AT1

DA14580-01AT1

Dialog Semiconductor

IC RF TXRX+MCU BLUETOOTH 40VFQFN

0

DA14695-00000HQ2

DA14695-00000HQ2

Dialog Semiconductor

MULTI-CORE WIRELESS MCU FOR BLUE

1075

DA14683-00000U22

DA14683-00000U22

Dialog Semiconductor

IC RF BLUETOOTH 5.0 SOC 53XFBGA

4829

DA14580-01UNA

DA14580-01UNA

Dialog Semiconductor

IC RF TXRX+MCU BLUETOOTH 34UFBGA

90

DA14683-00000A9

DA14683-00000A9

Dialog Semiconductor

IC RF BLUETOOTH 5.0 SOC 53XFBGA

3788

DA14585-00000VV2

DA14585-00000VV2

Dialog Semiconductor

IC RF TXRX+MCU BLUETOOTH 34XFBGA

10077

RF Transceiver ICs

1. Overview

RF (Radio Frequency) and IF (Intermediate Frequency) transceiver ICs are integrated circuits that enable wireless communication by transmitting and receiving radio signals. These devices are critical in modern technologies, supporting applications from cellular networks to IoT (Internet of Things). RFID (Radio-Frequency Identification) RF transceivers specialize in short-range communication for identification and tracking systems. Their miniaturization, energy efficiency, and reliability have driven advancements in connectivity across industries.

2. Major Types and Functional Classification

Type Functional Features Application Examples
Low-Power RF Transceivers Optimized for energy efficiency, supports sub-1GHz and 2.4GHz bands IoT sensors, smart meters, wearable devices
High-Performance RF Transceivers High output power (up to +20dBm), low phase noise 5G base stations, military communication systems
Multi-Band RF Transceivers Supports multiple frequency bands (e.g., 400MHz-6GHz) Dual-mode radios, global navigation systems
Integrated RFID Transceivers Embedded protocol handling, on-chip modulation/demodulation Inventory tracking, access control systems

3. Structure and Components

Typical RF transceiver ICs include:

  • Transmitter Section: Power Amplifier (PA), up-conversion mixer, frequency synthesizer
  • Receiver Section: Low-Noise Amplifier (LNA), down-conversion mixer, channel filter
  • Digital Baseband: ADC/DAC, error correction, protocol engine
  • Process Technology: CMOS, SiGe, or GaAs for high-frequency performance
  • Package Types: QFN (Quad Flat No-leads), BGA (Ball Grid Array)

4. Key Technical Specifications

Parameter Description Importance
Frequency Range Operational bandwidth (e.g., 868MHz-915MHz, 2.4GHz-5.8GHz) Determines application compatibility
Output Power Transmit power level (e.g., -20dBm to +20dBm) Impacts transmission distance and regulatory compliance
Receiver Sensitivity Minimum detectable signal level (e.g., -120dBm) Defines signal quality in noisy environments
Data Rate Maximum throughput (e.g., 1Mbps-1Gbps) Affects real-time data transmission capability
Power Consumption Operating current/voltage requirements Crucial for battery-powered devices

5. Application Areas

  • Telecommunications: 5G small cells, Wi-Fi 6 access points
  • Industrial IoT: Predictive maintenance sensors
  • Automotive: Tire Pressure Monitoring Systems (TPMS), keyless entry
  • Healthcare: Remote patient monitoring devices
  • Retail: Smart shelves with RFID inventory tracking

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
TI (Texas Instruments) CC1352P Sub-1GHz & 2.4GHz dual-band, +7dBm output power
Nordic Semiconductor nRF52840 Bluetooth 5.2, 2.4GHz, 128-bit AES encryption
STMicroelectronics S2-LP Very low-power (14mA RX), sub-GHz transceiver
Infineon Technologies BTS720 Automotive-grade RFID transceiver for immobilizers

7. Selection Guidelines

Key considerations include:

  • Frequency band alignment with regulatory standards (FCC, ETSI)
  • Power budget vs. transmission range requirements
  • Integration level (e.g., on-chip MCU, external PA needs)
  • Environmental factors (temperature range, EMI resilience)
  • Cost vs. performance trade-offs for mass production

8. Industry Trends

Future developments include:

  • Ultra-low-power designs for energy-harvesting IoT nodes
  • Massive MIMO integration for 6G infrastructure
  • AI-enhanced spectrum management algorithms
  • Expanded use of mmWave bands (24GHz+) for high-speed applications
  • Standardization of RFID protocols for global supply chains
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