RF Power Dividers/Splitters

Part Number	Description / PDF	Quantity
EHF-FD1508 Panasonic	RF POWER DIVIDER 981HZ-1008MHZ	998
EHF-FD1503 Panasonic	RF POWER DIVIDER 1.54GHZ-1.64GHZ	6995
EHF-FD1495 Panasonic	RF PWR DVDR 1607HZ-1685MHZ 0805	0
EHF-FD1502 Panasonic	RF POWER DIVIDER 720HZ-760MHZ	0
EHF-FD1507 Panasonic	RF POWER DIVIDER 1720HZ-1790MHZ	0
EHF-FD1506 Panasonic	RF POWER DIVIDER 1607HZ-1685MHZ	0
EHF-FD1509 Panasonic	RF POWER DIVIDER 2043HZ-2104MHZ	0
EHF-FD1779 Panasonic	RF POWER DIVIDER 720MHZ-1008MHZ	0
EHF-FD1513 Panasonic	RF POWER DIVIDER 1720HZ-1790MHZ	0
EHF-FD1545 Panasonic	RF POWER DIVIDER 650HZ-2000MHZ	0

RF Power Dividers/Splitters

1. Overview

RF/IF Power Dividers/Splitters are passive or active microwave components that split an input RF signal into two or more output signals with specific amplitude and phase relationships. They are critical in signal distribution, impedance matching, and system integration across wireless communication, test instrumentation, and RFID systems. Their ability to manage signal paths ensures optimal performance in multi-channel systems and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Passive Power Dividers	No external power required, low insertion loss, fixed splitting ratio	Base stations, DAS systems
Active Power Splitters	Amplified signal distribution, adjustable gain control	Signal boosters, repeaters
2-Way/3-Way/4-Way Dividers	Fixed output port configurations with phase-matched outputs	MIMO systems, phased arrays
Waveguide Power Dividers	High-power handling, low-loss at microwave frequencies	Satellite communications, radar
Microstrip Line Splitters	Compact PCB-based design, cost-effective mass production	IoT devices, RFID readers

3. Structure and Components

Typical physical structure includes: - Dielectric substrate (FR4, Rogers material) with conductive transmission lines - SMA/N-Type or waveguide connectors for RF ports - Resistive or reactive components for impedance matching - Metal housing for EMI shielding (1.5-3.0mm thickness) - Thermal management coatings for high-power models Key technologies: Wilkinson divider circuitry, quadrature hybrid couplers, and corporate feed networks implemented through PCB etching or ceramic substrates.

4. Key Technical Specifications

Parameter	Importance
Frequency Range (0.5-40 GHz)	Determines operational bandwidth and application compatibility
Insertion Loss (0.2-2.5 dB)	Impacts system signal integrity and noise figure
Isolation (15-30 dB)	Prevents crosstalk between output ports
Power Handling (5-500W)	Defines maximum operational safety margin
VSWR (1.1:1-1.5:1)	Indicates impedance matching quality
Phase Balance ( 1-5 )	Essential for coherent signal processing

5. Application Fields

Primary industries: - Telecommunications: 5G massive MIMO base stations, fiber DAS - Test & Measurement: Vector network analyzers, spectrum analyzers - RFID Systems: UHF Gen2 reader antenna multiplexing - Aerospace: Aircraft communication navigation systems (CNS) - Industrial IoT: Smart factory sensor networks Typical equipment: Anritsu MT8000A tester, Keysight N9020B analyzer, Impinj R420 reader.

6. Leading Manufacturers and Products

Manufacturer	Country	Representative Product
Analog Devices	USA	ADP-2181 (0.5-18GHz, 3-way splitter)
Mini-Circuits	USA	ZFRSC-42-S+ (2-40GHz, ultra-broadband)
RFMW Ltd.	Canada	RF3080 (8-12GHz, waveguide divider)
Murata Manufacturing	Japan	NX7060 Series (Sub-6GHz, LTE applications)
COMSAW	Korea	CSW-1500M (1.5-2.7GHz, 4G LTE splitter)

7. Selection Recommendations

Key considerations: - Frequency match with system operating band (include 20% margin) - Power handling requirement (continuous vs peak power) - Channel count vs phase coherence needs - Environmental rating (IP67 for outdoor deployments) - Connector type compatibility (SMA vs N-Type vs TNC) - Cost vs performance trade-off (Wilkinson vs hybrid designs) For RFID applications, prioritize models with excellent port isolation (>25dB) to prevent tag read interference.

8. Industry Trends

Current development directions: - mmWave compatibility (24-100GHz) for 5G/6G systems - Miniaturization through LTCC technology (size reduction >40%) - Integrated digital control for smart antenna systems - Improved thermal management materials (diamond substrate adoption) - Standardization of RFID-specific splitters under EPCglobal UHF Gen2v2