RF Multiplexers

Image Part Number Description / PDF Quantity Rfq
D5PE740M0P3NZ-Z

D5PE740M0P3NZ-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

D6NF1G960P1BR-Z

D6NF1G960P1BR-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

FI212P245003-T

FI212P245003-T

TAIYO YUDEN

RF DIPLEXER 5.025/5.6475GHZ MOD

0

FI168P245010-T

FI168P245010-T

TAIYO YUDEN

RF DIPLEXER 2.45GHZ/5.51GHZ 0603

0

FAR-D5NE-881M50-P1A6QZ

FAR-D5NE-881M50-P1A6QZ

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

FAR-D5PE-881M50-P3EZ-Z

FAR-D5PE-881M50-P3EZ-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

FAR-D5NC-881M50-M11B-Z

FAR-D5NC-881M50-M11B-Z

TAIYO YUDEN

RF DUPLEXER 8SMD NO LEAD

0

FAR-D6JG-2G1400-D3FZ-Z

FAR-D6JG-2G1400-D3FZ-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

FI212P0892M2-T

FI212P0892M2-T

TAIYO YUDEN

RF DIPLEX 824.5MHZ/1.94GHZ 0805

0

FAR-D5NE-881M50-P1A9-Z

FAR-D5NE-881M50-P1A9-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

FAR-D5PF-881M50-M3E7-Z

FAR-D5PF-881M50-M3E7-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

D5NL782M0P1JZ-Z

D5NL782M0P1JZ-Z

TAIYO YUDEN

RF DUPLEXER 1210

0

D6JG2G132D3GZ-Z

D6JG2G132D3GZ-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

FAR-D5PE-881M50-P3EY-Z

FAR-D5PE-881M50-P3EY-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

D6HL1G960DL33-Z

D6HL1G960DL33-Z

TAIYO YUDEN

FBAR DUPLEXER 2016 CSSD B2

0

FI168P245014-T

FI168P245014-T

TAIYO YUDEN

RF DIPLEXER 0603 6 PC PAD

0

D5GK942M5D1KB-Z

D5GK942M5D1KB-Z

TAIYO YUDEN

RF DUPLEXER

0

D5GG872M0D1GA-Z

D5GG872M0D1GA-Z

TAIYO YUDEN

RF DUPLEXER

0

D6PF1G960M3B9-Z

D6PF1G960M3B9-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

D5GD942M5D1DF-Z

D5GD942M5D1DF-Z

TAIYO YUDEN

RF DUPLEXER

0

RF Multiplexers

1. Overview

RF/IF multiplexers are devices that route high-frequency signals (typically 300 MHz to 6 GHz for RF, and 10 MHz to 1 GHz for IF) between multiple channels. RFID RF multiplexers specialize in managing signals for radio frequency identification systems (125 kHz to 900 MHz). These components enable efficient signal management in wireless communication, industrial automation, and IoT systems, reducing hardware complexity and cost.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Coaxial RF MultiplexerMechanical switching with high power handling (up to 100W)Test equipment, military communication
MMIC-based MultiplexerMonolithic Microwave IC integration, fast switching ( 1 s)5G base stations, phased array systems
UHF RFID MultiplexerSupports EPCglobal Gen2 protocol, 8-16 portsWarehouse inventory management
Fiber-Optic RF MultiplexerOptical signal routing, low insertion loss (<1 dB)Aerospace telemetry systems

3. Structure and Components

Typical construction includes: - Switch matrix (electromechanical relays or PIN diodes) - RF shielding enclosure (aluminum alloy) - SMA/N-type connectors - Control circuitry (TTL/CMOS interface) - Dielectric substrate (RO4000 series for high frequencies)

4. Key Technical Specifications

ParameterValue RangeImportance
Frequency RangeDC-18 GHzDetermines application compatibility
Insertion Loss0.3-3.5 dBSignal integrity preservation
Isolation20-80 dBPrevents channel cross-talk
Switching Speed10 s-10 msAffects system response time
VSWR1.2:1-2.0:1Impedance matching quality indicator

5. Application Fields

  • Telecom: Base station antenna sharing
  • Medical: MRI RF coil switching
  • Manufacturing: Automated test equipment (ATE)
  • Logistics: RFID warehouse tracking systems

6. Leading Manufacturers and Products

VendorProduct SeriesKey Features
Analog DevicesADG9xxCMOS-based, 0.1-3 GHz, 1.8-5.5V supply
Keysight TechnologiesU2000 SeriesOptical RF multiplexer with 0.05 dB accuracy
Nordic SemiconductornRF24 2.4 GHz, -94 dBm sensitivity for RFID
TE ConnectivityRF Multiplex SwitchIP67 rated for outdoor deployment

7. Selection Guidelines

Consider: 1. Frequency match with application band 2. Signal power handling requirements 3. Environmental conditions (temperature/humidity) 4. Control interface compatibility (SPI/UART) 5. Port count scalability 6. Cost vs. performance trade-offs

8. Industry Trends

Current developments include: - Integration with AI for dynamic signal path optimization - Sub-6 GHz 5G MIMO support expansion - Development of reconfigurable intelligent surfaces (RIS) - RFID multiplexers with embedded sensing capabilities - Miniaturization using LTCC packaging technology

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