| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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RF360 - A Qualcomm-TDK joint venture |
RF DIPLEXER 881.5/942.5MHZ 10SMD |
0 |
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RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 897.5/942.5MHZ 9SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 710MHZ/740MHZ 9SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 782MHZ/751MHZ 8SMD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DIPLEXER 8SMD NO LEAD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 9SMD NO LEAD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 751MHZ/782MHZ 9SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 1.7325/2.1125GHZ SMD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF TRIPLEXER 859MHZ/1.92GHZ 6SMD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 1.88108/1.96GHZ 8SMD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 704MHZ / 734MHZ 8SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 1.75/1.84GHZ 9SMD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DIPLEXER 8SMD NO LEAD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF TRIPLEXER 859MHZ/1.92GHZ 6SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 914.5/959.5MHZ 8SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DIPLEXER 1.8425/1.96GHZ 10SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 2.535/2.655GHZ 9SMD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 9SMD NO LEAD |
0 |
|
 |
RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 763MHZ/793MHZ 9SMD |
0 |
|
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RF360 - A Qualcomm-TDK joint venture |
RF DUPLEXER 710MHZ/740MHZ 8SMD |
0 |
|
RF/IF multiplexers are devices that route high-frequency signals (typically 300 MHz to 6 GHz for RF, and 10 MHz to 1 GHz for IF) between multiple channels. RFID RF multiplexers specialize in managing signals for radio frequency identification systems (125 kHz to 900 MHz). These components enable efficient signal management in wireless communication, industrial automation, and IoT systems, reducing hardware complexity and cost.
| Type | Functional Features | Application Examples |
|---|---|---|
| Coaxial RF Multiplexer | Mechanical switching with high power handling (up to 100W) | Test equipment, military communication |
| MMIC-based Multiplexer | Monolithic Microwave IC integration, fast switching ( 1 s) | 5G base stations, phased array systems |
| UHF RFID Multiplexer | Supports EPCglobal Gen2 protocol, 8-16 ports | Warehouse inventory management |
| Fiber-Optic RF Multiplexer | Optical signal routing, low insertion loss (<1 dB) | Aerospace telemetry systems |
Typical construction includes: - Switch matrix (electromechanical relays or PIN diodes) - RF shielding enclosure (aluminum alloy) - SMA/N-type connectors - Control circuitry (TTL/CMOS interface) - Dielectric substrate (RO4000 series for high frequencies)
| Parameter | Value Range | Importance |
|---|---|---|
| Frequency Range | DC-18 GHz | Determines application compatibility |
| Insertion Loss | 0.3-3.5 dB | Signal integrity preservation |
| Isolation | 20-80 dB | Prevents channel cross-talk |
| Switching Speed | 10 s-10 ms | Affects system response time |
| VSWR | 1.2:1-2.0:1 | Impedance matching quality indicator |
| Vendor | Product Series | Key Features |
|---|---|---|
| Analog Devices | ADG9xx | CMOS-based, 0.1-3 GHz, 1.8-5.5V supply |
| Keysight Technologies | U2000 Series | Optical RF multiplexer with 0.05 dB accuracy |
| Nordic Semiconductor | nRF24 | 2.4 GHz, -94 dBm sensitivity for RFID |
| TE Connectivity | RF Multiplex Switch | IP67 rated for outdoor deployment |
Consider: 1. Frequency match with application band 2. Signal power handling requirements 3. Environmental conditions (temperature/humidity) 4. Control interface compatibility (SPI/UART) 5. Port count scalability 6. Cost vs. performance trade-offs
Current developments include: - Integration with AI for dynamic signal path optimization - Sub-6 GHz 5G MIMO support expansion - Development of reconfigurable intelligent surfaces (RIS) - RFID multiplexers with embedded sensing capabilities - Miniaturization using LTCC packaging technology