RF Multiplexers

Image Part Number Description / PDF Quantity Rfq
MAFL-011055

MAFL-011055

Metelics (MACOM Technology Solutions)

RF DIPLEXER MODULE

2200

DPX165950DT-8126A1

DPX165950DT-8126A1

TDK Corporation

RF DIPLEXER 2.45/5.425GHZ 0603

2386

FI168P245030-T

FI168P245030-T

TAIYO YUDEN

RF DIPLEXER 1.584/5.425GHZ 0603

7725

2450DP15F5400E

2450DP15F5400E

Johanson Technology

RF DIPLEXER 2.45GHZ/5.4GHZ 0805

0

B39781B8005P810

B39781B8005P810

RF360 - A Qualcomm-TDK joint venture

RF DUPLEXER 751MHZ/782MHZ 9SMD

4184

AD1950-2140D269-N

AD1950-2140D269-N

Anatech Electronics Inc.

1950 MHZ / 2140 MHZ CAVITY DUPLE

10

AE710-737DB5474

AE710-737DB5474

Anatech Electronics Inc.

710 MHZ / 737 MHZ CAVITY DUPLEXE

10

D6HQ1G962DP35-Z

D6HQ1G962DP35-Z

TAIYO YUDEN

SAW FILTER

1187

D6DA2G140K2A4-Z

D6DA2G140K2A4-Z

TAIYO YUDEN

RF DUPLEXER 1.95GHZ/2.14GHZ 8SMD

874

AE2535-2655DB5457

AE2535-2655DB5457

Anatech Electronics Inc.

2535 MHZ / 2655 MHZ CAVITY DUPLE

10

D5PF876M5M3U9-Z

D5PF876M5M3U9-Z

TAIYO YUDEN

RF DUPLEXER 830MHZ/876.5MHZ 9SMD

327

DPX252500DT-5217A1

DPX252500DT-5217A1

TDK Corporation

RF DIPLEXER 1.575/2.45GHZ 1008

223

DIP1524-01D3

DIP1524-01D3

STMicroelectronics

RF DIPLX 1589.655MHZ/2.55GHZ BGA

4361

FI212P082934-T

FI212P082934-T

TAIYO YUDEN

RF DIPLEXER 829MHZ/4.692GHZ 0805

3156

ASNT5050

ASNT5050

ADSANTEC

32GB 2:1 DIG. MULTIPLEXER/SWITCH

180

200000392

200000392

Amphenol

DPF 70/6-5/7 N..

100

D5DA737M5K2H2-Z

D5DA737M5K2H2-Z

TAIYO YUDEN

RF DUPLEXER 707.5/737.5MHZ 8SMD

2695

B39881B8013P810

B39881B8013P810

RF360 - A Qualcomm-TDK joint venture

RF DUPLEXER 836.5/881.5MHZ 9SMD

3791

AE1800-2350DB5477

AE1800-2350DB5477

Anatech Electronics Inc.

1800 MHZ / 2350 MHZ CAVITY DUPLE

10

ASNT5090

ASNT5090

ADSANTEC

32GB 1:2 DEMULTIPLEXER, LOW JITT

250

RF Multiplexers

1. Overview

RF/IF multiplexers are devices that route high-frequency signals (typically 300 MHz to 6 GHz for RF, and 10 MHz to 1 GHz for IF) between multiple channels. RFID RF multiplexers specialize in managing signals for radio frequency identification systems (125 kHz to 900 MHz). These components enable efficient signal management in wireless communication, industrial automation, and IoT systems, reducing hardware complexity and cost.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Coaxial RF MultiplexerMechanical switching with high power handling (up to 100W)Test equipment, military communication
MMIC-based MultiplexerMonolithic Microwave IC integration, fast switching ( 1 s)5G base stations, phased array systems
UHF RFID MultiplexerSupports EPCglobal Gen2 protocol, 8-16 portsWarehouse inventory management
Fiber-Optic RF MultiplexerOptical signal routing, low insertion loss (<1 dB)Aerospace telemetry systems

3. Structure and Components

Typical construction includes: - Switch matrix (electromechanical relays or PIN diodes) - RF shielding enclosure (aluminum alloy) - SMA/N-type connectors - Control circuitry (TTL/CMOS interface) - Dielectric substrate (RO4000 series for high frequencies)

4. Key Technical Specifications

ParameterValue RangeImportance
Frequency RangeDC-18 GHzDetermines application compatibility
Insertion Loss0.3-3.5 dBSignal integrity preservation
Isolation20-80 dBPrevents channel cross-talk
Switching Speed10 s-10 msAffects system response time
VSWR1.2:1-2.0:1Impedance matching quality indicator

5. Application Fields

  • Telecom: Base station antenna sharing
  • Medical: MRI RF coil switching
  • Manufacturing: Automated test equipment (ATE)
  • Logistics: RFID warehouse tracking systems

6. Leading Manufacturers and Products

VendorProduct SeriesKey Features
Analog DevicesADG9xxCMOS-based, 0.1-3 GHz, 1.8-5.5V supply
Keysight TechnologiesU2000 SeriesOptical RF multiplexer with 0.05 dB accuracy
Nordic SemiconductornRF24 2.4 GHz, -94 dBm sensitivity for RFID
TE ConnectivityRF Multiplex SwitchIP67 rated for outdoor deployment

7. Selection Guidelines

Consider: 1. Frequency match with application band 2. Signal power handling requirements 3. Environmental conditions (temperature/humidity) 4. Control interface compatibility (SPI/UART) 5. Port count scalability 6. Cost vs. performance trade-offs

8. Industry Trends

Current developments include: - Integration with AI for dynamic signal path optimization - Sub-6 GHz 5G MIMO support expansion - Development of reconfigurable intelligent surfaces (RIS) - RFID multiplexers with embedded sensing capabilities - Miniaturization using LTCC packaging technology

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