RF Misc ICs and Modules

Image Part Number Description / PDF Quantity Rfq
SX1308IMLTRT

SX1308IMLTRT

Semtech

IC DIGITAL BASEBAND LORA

4597

SX1308P915GW

SX1308P915GW

Semtech

915MHZ PICOCELL GATEWAY V1.0 DEV

19

SX1301IMLTRC

SX1301IMLTRC

Semtech

IC DIGITAL BASEBAND LORA

1311

SX1303IMLTRT

SX1303IMLTRT

Semtech

SX1303: LORA 2ND GEN B-BAND W. T

0

SX1302C915GW1

SX1302C915GW1

Semtech

SX1302 915MHZ LORA GATEWAY

8

SX1302IMLTRT

SX1302IMLTRT

Semtech

LORA GATEWAY BASEBAND TRANSCEIVE

2922

SX9210ICSTRT

SX9210ICSTRT

Semtech

SX9210 LOW POWER WEARABLE

630

SX1302C868GW1

SX1302C868GW1

Semtech

SX1302 868MHZ LORA GATEWAY

11

GT1704-IBE3

GT1704-IBE3

Semtech

IC GEN CHECK 12.8G PRBS FBGA

0

GT1706-IBE3

GT1706-IBE3

Semtech

IC CROSSPOINT SW 14.5G 100BGA

0

SX1301AP1BAS

SX1301AP1BAS

Semtech

IC RF BASEBAND DIGITAL LORA

0

ZRI882IMLTRT

ZRI882IMLTRT

Semtech

IC RF TRANSMITTER SMD

0

RF66IMLTRT

RF66IMLTRT

Semtech

IC RF TRANSMITTER SMD

0

RF Misc ICs and Modules

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) RF miscellaneous ICs and modules are critical components in wireless communication systems. RF/IF devices process signals in the radio and intermediate frequency ranges, enabling signal modulation, amplification, and filtering. RFID RF components facilitate contactless data exchange between tags and readers. These technologies underpin modern wireless applications, including telecommunications, IoT, and automated identification systems, driving efficiency and connectivity across industries.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RF AmplifiersBoost signal strength while maintaining linearity5G base stations, satellite communication
Mixers/ConvertersTranslate frequencies for signal processingWireless transceivers, radar systems
RFID Reader ModulesEncode/decode data via electromagnetic couplingAccess control, inventory management
FiltersSuppress unwanted frequenciesSmartphones, industrial sensors
RFID Tags (Passive/Active)Store/transmit unique identifiers without batteries (passive) or with batteries (active)Asset tracking, supply chain logistics

3. Structure and Composition

Typical RF/RFID modules consist of: - Substrate Materials: Ceramic, FR4, or flexible PCBs for signal integrity - Active Components: GaAs FETs, CMOS transistors for amplification/switching - Passive Components: Inductors, capacitors, and resonators for filtering/tuning - Encapsulation: QFN, BGA, or hybrid packages for EMI shielding - Antenna Interfaces: Impedance-matched circuits for efficient energy transfer

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 860MHz-960MHz for UHF RFID)Determines application compatibility
Output PowerTransmitted RF power (dBm)Affects communication distance
Insertion LossSignal attenuation through the deviceImpacts system efficiency
Read RangeMaximum tag-reader distance (for RFID)Defines deployment flexibility
Power ConsumptionOperating current/voltage requirementsCrucial for battery-powered devices

5. Application Domains

  • Telecommunications: 5G infrastructure, Wi-Fi 6 modules
  • Healthcare: Real-time patient monitoring wearables
  • Logistics: Automated warehouse inventory systems
  • Automotive: Tire pressure monitoring systems (TPMS)
  • Retail: NFC-enabled payment terminals

6. Leading Manufacturers and Products

VendorProduct ExampleKey Features
Texas InstrumentsCC1310 Wireless MCUSub-1GHz IoT connectivity, 6mm package
NXP SemiconductorsMR2001 RFID ReaderUHF Gen2 protocol support
STMicroelectronicsVN8040 Full-Bridge DriverHigh-side/low-side RF switching
ImpinjMonza X-8K Tag IC96-bit EPC memory, 15-meter read range

7. Selection Guidelines

Key considerations include: - Match frequency specifications to regulatory standards (FCC/ETSI) - Balance power efficiency with required transmission range - Ensure environmental durability (temperature, moisture) - Verify protocol compatibility (e.g., ISO/IEC 14443 for NFC) - Prioritize integration simplicity via development kits/support

8. Industry Trends

Emerging developments include: - Higher Integration: Multi-function SiP (System-in-Package) solutions - mmWave Expansion: 24GHz+ modules for automotive radar and 5G - Energy Harvesting: Self-powered RFID sensors for industrial IoT - AIR (Ambient RF) Technology: Backscatter communication without dedicated readers - AI-Driven Optimization: Machine learning for dynamic frequency adjustment

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