RF Front End (LNA + PA)

Part Number	Description / PDF	Quantity
SKY78130-13 Skyworks Solutions, Inc.	IC MOD FRONT END WCDMA LTE	0
LX5601L Microsemi	WIRELESS LAN FRONT-END MODULE	0
SKY77580 Skyworks Solutions, Inc.	IC TRANSMITTER/RECEIVER 28MCM	0
SKY65346-11 Skyworks Solutions, Inc.	IC FRONT END 900MHZ 26-MCM	0
PE53211A-Z pSemi	MODULE LNA 2-CH SWITCH 32LGA	0
RFX8053 Skyworks Solutions, Inc.	IC FRONT END MOD 5GHZ WLAN 16QFN	12500
SST11CP22-GN Roving Networks / Microchip Technology	IC MOD PAM WLAN 11A/N/AC 20UQFN	0
SKY77548-11 Skyworks Solutions, Inc.	IC TXRX TRANSMIT FEM MCM	0
SKY65311-21 Skyworks Solutions, Inc.	IC FRONT-END MODULE	0
SKY77547-11 Skyworks Solutions, Inc.	IC TXRX TRANSMIT FEM MCM	0
AFEM-S106-TR1G Broadcom	FIBER OPTIC TRANSCEIVER	0
SKY78131-21 Skyworks Solutions, Inc.	IC MOD FRONT END WCDMA LTE	0
LX5584HLL Microsemi	WIRELESS LAN FRONT-END MODULE	0
LX5584BLL Microsemi	WIRELESS LAN FRONT-END MODULE	0
SKY85724-11 Skyworks Solutions, Inc.	IC AMP LNA FRONT END 10DFN	0
SST11LF05-QVCE Roving Networks / Microchip Technology	IC MOD FEM WLAN 11A/N/AC 16VQFN	0
SE2577L-RC Skyworks Solutions, Inc.	IC RF DUAL SW DIPLEX 3X3 QFN	0
AFEM-8007-TR1 Broadcom	IC FRONT END	0
AFEM-S105-TR1G Broadcom	IC FRONT END MOD 5GHZ WIFI	0
SST12LF01-QDF Roving Networks / Microchip Technology	IC FRONT-END MODULE 24WQFN	0

RF Front End (LNA + PA)

1. Overview

An RF Front End (LNA + PA) integrates a Low Noise Amplifier (LNA) and Power Amplifier (PA) to manage signal transmission and reception in radio frequency systems. The LNA amplifies weak incoming signals with minimal noise addition, while the PA boosts outgoing signals to achieve desired transmission power. These components are critical in wireless communication systems, RFID readers, and IoT devices, enabling reliable data exchange and long-range connectivity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Low-Frequency (LF) RFID Front End	Operates at 30 kHz 300 kHz, high sensitivity for short-range detection	Access control systems, animal tracking
High-Frequency (HF) RFID Front End	13.56 MHz operation, supports mid-range communication	Smart posters, ticketing systems
Ultra-High Frequency (UHF) Front End	860 960 MHz, extended read range up to 15 meters	Supply chain logistics, inventory management
Integrated LNA+PA Modules	Single-package solution for transceiver systems	5G base stations, automotive radar

3. Structure and Components

A typical RF Front End combines:

LNA Section: GaAs or SiGe transistors with input matching networks
PA Section: Gallium Nitride (GaN) or Laterally Diffused MOSFET (LDMOS) devices
Bandpass filters for frequency selectivity
Impedance matching circuits (50 standard)
Thermal management structures (heat sinks or thermal vias)

4. Key Technical Specifications

Parameter	Description	Typical Values
Frequency Range	Operating bandwidth of the front end	LF: 125 kHz, HF: 13.56 MHz, UHF: 900 MHz
Gain (LNA)	Signal amplification level	15 30 dB
Noise Figure (LNA)	Measure of signal-to-noise degradation	0.5 3 dB
Output Power (PA)	Transmitted signal strength	20 40 dBm
Power Added Efficiency (PAE)	Energy conversion efficiency	40 70%
Input/Output Impedance	Matching network characteristic	50 standard

5. Application Fields

Main industries:

Telecommunications (5G infrastructure, satellite communication)
RFID systems (warehouse tracking, contactless payments)
Industrial IoT (sensor networks, asset monitoring)
Automotive (V2X communication, tire pressure sensors)

Typical devices: RFID readers, smart meters, drones, medical telemetry systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Analog Devices	HMC1060LP5E	DC-6 GHz LNA+PA module for test equipment
Qorvo	RFFM6902	Sub-1 GHz front end for IoT devices
Nordic Semiconductor	nRF21540	2.4 GHz range extender for Bluetooth systems
STMicroelectronics	ST25R3911B	HF RFID reader with integrated LNA

7. Selection Recommendations

Key considerations:

Match frequency range to system requirements
Balance gain/noise figure for receiver sensitivity
Verify PA output power against regulatory limits
Evaluate package size for PCB integration
Assess temperature stability (-40 C to +85 C typical)
Compare power consumption for battery-operated devices

Industry Trend Analysis

Future directions include:

Advanced CMOS integration reducing discrete component needs
Adoption of GaN-on-SiC for higher power density
AI-driven dynamic impedance matching
Miniaturization for wearable and implantable devices
Multi-band front ends supporting 5G and Wi-Fi 6E coexistence

Market growth driven by IoT expansion and RFID adoption in smart cities, projected at 12% CAGR (2023-2030).