RF Evaluation and Development Kits, Boards

Image Part Number Description / PDF Quantity Rfq
3990252034

3990252034

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WE866C6-P INTERFACE BOARD ADAPTO

0

882-0041

882-0041

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OMNIVISION 720P VIDEO+AUDIO ADK

0

882-0031

882-0031

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KIT AEK HIFI BF527 SOC W/HW

0

882-0021

882-0021

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KIT ADK SMARTPLG W/HW

0

882-0032

882-0032

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KIT ADK PROV NO HW

0

882-0040

882-0040

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OMNIVISION 720P HD VIDEO + AUDIO

1

882-0023

882-0023

Telit

KIT ADK VID 720P H264 OV788 W/HW

0

GS-AEK-THERMOSTAT

GS-AEK-THERMOSTAT

Telit

EVAL THERMOSTAT GS1011M RL78L13

0

882-0025

882-0025

Telit

KIT ADK VIDEO VGA OV780 W/HW

0

882-0033

882-0033

Telit

KIT ADK OTAFU NO HW

0

3990150526

3990150526

Telit

BOARD EVAL FOR JUPITER SL869

0

882-0034

882-0034

Telit

KIT ADK TLS WEB SERV NO HW

0

882-0022

882-0022

Telit

KIT ADK AUDIO VLSI1053 W/HW

0

808-0075

808-0075

Telit

RF EVAL DEV KIT GS2200MIE

0

882-0028

882-0028

Telit

KIT ADK AUDIO BF527 SOC W/HW

0

808-0051

808-0051

Telit

EVAL BOARD FOR GS2100MIP

0

882-0019

882-0019

Telit

KIT AEK 720P H264 OV788 W/HW

0

J-F2-B3EV-DT

J-F2-B3EV-DT

Telit

EVAL KIT GPS SSIV

0

AA003257-G

AA003257-G

Telit

DEV KIT FOR JUPITER 32XLP

0

3990150507

3990150507

Telit

BOARD EVAL FOR JUPITER SL869

0

RF Evaluation and Development Kits, Boards

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RF Evaluation BoardsFocus on RF signal generation, modulation/demodulation, and impedance matching testing5G base station prototyping, Wi-Fi 6 module testing
RFID Development KitsSupport NFC, UHF/HF RFID tag/reader development with protocol analysisSmart retail payment systems, asset tracking solutions
Multifunctional Development BoardsIntegrate RF, microcontroller, and sensor interfaces for system-level testingIndustrial IoT gateway development, drone communication modules

3. Structure and Components

Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 300 MHz - 6 GHz)Determines application compatibility
Output PowerTransmit power level (e.g., -20 to +20 dBm)Impacts communication distance and FCC compliance
Receiver SensitivityMinimum detectable signal level (e.g., -120 dBm)Affects signal reliability in noisy environments
Impedance MatchingVSWR (Voltage Standing Wave Ratio) 2:1Ensures minimal signal reflection
Power Supply RequirementsVoltage/current specifications (e.g., 3.3V 5%)Critical for system integration

5. Application Areas

  • Telecommunications: 5G NR network testing, satellite communication simulation
  • Healthcare: Wireless patient monitoring device development
  • Retail: NFC-based payment terminal prototyping
  • Industrial: RFID-enabled supply chain automation

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsAFE7444EVMQuad-channel RF-sampling transceiver evaluation
STMicroelectronicsST25RU3993-DISCOUHF RFID reader IC development kit
Nordic SemiconductornRF52840-DKBluetooth 5.2 and Thread protocol testing
Impinj Speedway R420UHF Gen2 RFID reader for logistics automation

7. Selection Guidelines

Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget

8. Industry Trends

Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors

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