| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Silicon Labs |
DEV KIT WIRELESS EZR32HG 868MHZ |
2 |
|
 |
Silicon Labs |
WF200 WI-FI EXPANSION BOARD |
32 |
|
 |
Silicon Labs |
EFR32FG14 2400/434 MHZ 10 DBM RA |
22 |
|
 |
Silicon Labs |
EVAL BOARD Z-WAVE FOR ZM5202 |
5 |
|
 |
Silicon Labs |
KIT DEVELOPMENT ISM 3 |
2 |
|
 |
Silicon Labs |
WGM160P WI-FI MODULE STARTER KIT |
25 |
|
 |
Silicon Labs |
WIRELESS RF PICO BOARD |
5 |
|
 |
Silicon Labs |
XGM210P032 WIRELESS GECKO MODULE |
48 |
|
 |
Silicon Labs |
CONTROLLER USB Z-WAVE |
117 |
|
 |
Silicon Labs |
BIDIRECTIONAL +20DBM LINK FOR CH |
0 |
|
 |
Silicon Labs |
KIT DEVELOPMENT FOR ETRX357 |
6 |
|
 |
Silicon Labs |
MGM12P 2.4 GHZ +18 DBM W/LNA RAD |
36 |
|
 |
Silicon Labs |
DEV KIT FOR Z-WAVE 500SERIES |
22 |
|
 |
Silicon Labs |
EZR32WG 490 MHZ 20 DBM RADIO BOA |
12 |
|
 |
Silicon Labs |
EFR32MG 2400/868 MHZ 13 DBM DUAL |
8 |
|
 |
Silicon Labs |
EZR32WG 868 MHZ 13 DBM RADIO BOA |
4 |
|
 |
Silicon Labs |
DEV KIT WIRELESS EZR32HG 915MHZ |
1 |
|
 |
Silicon Labs |
DEV KIT WIRELESS EZR32HG 169MHZ |
0 |
|
 |
Silicon Labs |
BOARD STACK EM357 MOD & BREAKOUT |
0 |
|
 |
Silicon Labs |
PICO BOARD 169MHZ ETSI CAT1 |
2 |
|
RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.
| Type | Functional Features | Application Examples |
|---|---|---|
| RF Evaluation Boards | Focus on RF signal generation, modulation/demodulation, and impedance matching testing | 5G base station prototyping, Wi-Fi 6 module testing |
| RFID Development Kits | Support NFC, UHF/HF RFID tag/reader development with protocol analysis | Smart retail payment systems, asset tracking solutions |
| Multifunctional Development Boards | Integrate RF, microcontroller, and sensor interfaces for system-level testing | Industrial IoT gateway development, drone communication modules |
Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components
| Parameter | Description | Importance |
|---|---|---|
| Frequency Range | Operational bandwidth (e.g., 300 MHz - 6 GHz) | Determines application compatibility |
| Output Power | Transmit power level (e.g., -20 to +20 dBm) | Impacts communication distance and FCC compliance |
| Receiver Sensitivity | Minimum detectable signal level (e.g., -120 dBm) | Affects signal reliability in noisy environments |
| Impedance Matching | VSWR (Voltage Standing Wave Ratio) 2:1 | Ensures minimal signal reflection |
| Power Supply Requirements | Voltage/current specifications (e.g., 3.3V 5%) | Critical for system integration |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | AFE7444EVM | Quad-channel RF-sampling transceiver evaluation |
| STMicroelectronics | ST25RU3993-DISCO | UHF RFID reader IC development kit |
| Nordic Semiconductor | nRF52840-DK | Bluetooth 5.2 and Thread protocol testing |
| Impinj | Speedway R420 | UHF Gen2 RFID reader for logistics automation |
Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget
Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors