RF Evaluation and Development Kits, Boards

Image Part Number Description / PDF Quantity Rfq
H2B1BG2A1B0100

H2B1BG2A1B0100

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EVB AA055A WIFI/BT 2400-2500MHZ

10

H2B1SG1A2C0400

H2B1SG1A2C0400

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EVB AA066 915MHZ ISM 902-928MHZ

9

H2B1SG1A2C0300

H2B1SG1A2C0300

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EVB AA702 915MHZ ISM 902-928MHZ

14

H2B1MH3A2F0100

H2B1MH3A2F0100

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EVB CC40D9 LTE/4G FULL BAND 698-

22

H2B1AF1A2T0100

H2B1AF1A2T0100

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EVB PB40D9 CASTLE SERIES GNSS L1

17

H2B1MH2A2F0100

H2B1MH2A2F0100

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EVB CC35D8 LTE/4G FULL BAND 698-

11

H2B1SG1A1S0300

H2B1SG1A1S0300

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EVB AA701 868MHZ ISM 863-870MHZ

20

H2B1BG3A1B0100

H2B1BG3A1B0100

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EVB CW10D7 PILLAR CHIP ANTENNA W

19

H2B1MH4A2F0100

H2B1MH4A2F0100

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EVB CC40D7J LTE/4G FULL BAND 617

18

H2B1SG1A1S0400

H2B1SG1A1S0400

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EVB AA067 868MHZ ISM 863-870MHZ

17

H2B1DG1A1G0200

H2B1DG1A1G0200

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EVB AA089 WIFI+GNSS 1560-1610 24

15

H2B1PG1A1C0200

H2B1PG1A1C0200

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EVB AA077 DUAL BAND WIFI TELA CE

16

H2B1AG2A2B0100

H2B1AG2A2B0100

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EVB AA088 GNSS 1560-1606 MHZ WID

26

H2B1CB1A1B0100

H2B1CB1A1B0100

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EVB CW337 PILLAR CHIP ANTENNA WI

17

H2B1AF1A2N0100

H2B1AF1A2N0100

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EVB AA650 GNSS 1560-1606 MHZ ULT

20

H2B1AG1A2L0200

H2B1AG1A2L0200

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EVB AA099 DUAL BAND WIFI+GNSS 15

18

RF Evaluation and Development Kits, Boards

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RF Evaluation BoardsFocus on RF signal generation, modulation/demodulation, and impedance matching testing5G base station prototyping, Wi-Fi 6 module testing
RFID Development KitsSupport NFC, UHF/HF RFID tag/reader development with protocol analysisSmart retail payment systems, asset tracking solutions
Multifunctional Development BoardsIntegrate RF, microcontroller, and sensor interfaces for system-level testingIndustrial IoT gateway development, drone communication modules

3. Structure and Components

Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 300 MHz - 6 GHz)Determines application compatibility
Output PowerTransmit power level (e.g., -20 to +20 dBm)Impacts communication distance and FCC compliance
Receiver SensitivityMinimum detectable signal level (e.g., -120 dBm)Affects signal reliability in noisy environments
Impedance MatchingVSWR (Voltage Standing Wave Ratio) 2:1Ensures minimal signal reflection
Power Supply RequirementsVoltage/current specifications (e.g., 3.3V 5%)Critical for system integration

5. Application Areas

  • Telecommunications: 5G NR network testing, satellite communication simulation
  • Healthcare: Wireless patient monitoring device development
  • Retail: NFC-based payment terminal prototyping
  • Industrial: RFID-enabled supply chain automation

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsAFE7444EVMQuad-channel RF-sampling transceiver evaluation
STMicroelectronicsST25RU3993-DISCOUHF RFID reader IC development kit
Nordic SemiconductornRF52840-DKBluetooth 5.2 and Thread protocol testing
Impinj Speedway R420UHF Gen2 RFID reader for logistics automation

7. Selection Guidelines

Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget

8. Industry Trends

Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors

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