| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 18.0-26.5 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 500MHZ-8GHZ MOD |
11 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 1.70-2.60 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 12.4-18.0 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 2GHZ-8GHZ MODULE |
4 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 12.4GHZ-18GHZ MOD |
14 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 22.0-33.0 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 6GHZ-18GHZ MODULE |
2 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 26.5-40.0 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 2GHZ-18GHZ MODULE |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 8.20-12.4 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 6GHZ-18GHZ MODULE |
33 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 2GHZ-4GHZ MODULE |
36 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 6GHZ-18GHZ MODULE |
39 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 2GHZ-8GHZ MODULE |
3 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
CROSSGUIDE DIR COUP 4.90-7.05 SM |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 1-3.5GHZ MODULE |
3 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
HIGH DIRECTIVITY COUPLER ASSY |
0 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
DIRECTIONAL COUPLER |
22 |
|
 |
MITEQ, Inc.（L3 Narda-MITEQ） |
RF DIR COUPLER 2GHZ-4GHZ MODULE |
0 |
|
Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.
| Type | Functional Features | Application Examples |
|---|---|---|
| Microwave Ridge Waveguide | High power handling (100W+), broadband operation | 5G Base stations, Satellite communication |
| Coaxial Line | Compact design, 50/75 impedance options | RFID readers, Test equipment |
| Microstrip Planar | Low profile, Surface-mount compatible | WLAN routers, IoT modules |
| Hybrid Coupler | 3dB power split with phase matching | MIMO systems, Beamforming networks |
Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets
| Parameter | Typical Range | Importance |
|---|---|---|
| Coupling Factor | 3-40 dB | Determines sampled power level |
| Directivity | 15-40 dB | Measures forward/reverse signal separation |
| Insertion Loss | 0.1-2.0 dB | Impacts system power efficiency |
| VSWR | 1.1:1 - 1.5:1 | Affects impedance matching quality |
| Frequency Range | 30 MHz - 110 GHz | Defines operational bandwidth |
Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Analog Devices | ADL5523 | 40GHz broadband, 20dB coupling accuracy |
| Mini-Circuits | ZFDC-20-63-S+ | DC-20GHz, 3.5mm connectorized |
| TE Connectivity | RF-0424-01 | Automotive-grade RFID coupler |
| KRYTAR | 10104800 | 10-48GHz, 50dB dynamic range |
Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)
Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research