| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
TDK Corporation |
THIN-FILM DIRECTIONLA COUPLER FO |
33711 |
|
 |
TDK Corporation |
MULTILAYER DIRECTIONAL COUPLER F |
4249 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4-2.5GHZ 0202 |
27608 |
|
 |
TDK Corporation |
RF DIR COUPLER 450-3800MHZ 1608 |
4543 |
|
 |
TDK Corporation |
RF DIR COUPLER 1.71GHZ-2.03GHZ |
0 |
|
 |
TDK Corporation |
RF DIR COUPLR 1.71-1.785GHZ 0603 |
7774 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4-2.5GHZ 0402 |
22608 |
|
 |
TDK Corporation |
RF DIR COUPLER 777-925MHZ 0402 |
2368 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4GHZ-2.5GHZ SMD |
3880 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4-2.5GHZ 0202 |
8690 |
|
 |
TDK Corporation |
RF DIR COUPLER 1.71GHZ-1.98GHZ |
8800 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4-2.5GHZ 0402 |
9918 |
|
 |
TDK Corporation |
RF DIR COUPLER 0402 |
9575 |
|
 |
TDK Corporation |
RF DIR COUPLER 698-2620MHZ 0603 |
8354 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4-2.5GHZ 0402 |
15848 |
|
 |
TDK Corporation |
RF DIR COUPLER 2.4-2.5GHZ 0402 |
6716 |
|
 |
TDK Corporation |
RF DIR COUPLER 824-915MHZ 0603 |
3146 |
|
 |
TDK Corporation |
RF DIR COUPLER 824-915MHZ 0805 |
0 |
|
 |
TDK Corporation |
RF DIR COUPLER 1.92-1.98GHZ 0603 |
1556 |
|
 |
TDK Corporation |
COUPLER |
0 |
|
Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.
| Type | Functional Features | Application Examples |
|---|---|---|
| Microwave Ridge Waveguide | High power handling (100W+), broadband operation | 5G Base stations, Satellite communication |
| Coaxial Line | Compact design, 50/75 impedance options | RFID readers, Test equipment |
| Microstrip Planar | Low profile, Surface-mount compatible | WLAN routers, IoT modules |
| Hybrid Coupler | 3dB power split with phase matching | MIMO systems, Beamforming networks |
Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets
| Parameter | Typical Range | Importance |
|---|---|---|
| Coupling Factor | 3-40 dB | Determines sampled power level |
| Directivity | 15-40 dB | Measures forward/reverse signal separation |
| Insertion Loss | 0.1-2.0 dB | Impacts system power efficiency |
| VSWR | 1.1:1 - 1.5:1 | Affects impedance matching quality |
| Frequency Range | 30 MHz - 110 GHz | Defines operational bandwidth |
Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Analog Devices | ADL5523 | 40GHz broadband, 20dB coupling accuracy |
| Mini-Circuits | ZFDC-20-63-S+ | DC-20GHz, 3.5mm connectorized |
| TE Connectivity | RF-0424-01 | Automotive-grade RFID coupler |
| KRYTAR | 10104800 | 10-48GHz, 50dB dynamic range |
Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)
Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research