RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
C2023J5003AHF

C2023J5003AHF

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ 0805

32264

X3C07P1-03S

X3C07P1-03S

Anaren

RF DIR COUPLER 600-900MHZ 4SMD

2616

DC1722J5020AHF

DC1722J5020AHF

Anaren

RF DIR COUPLER 1.7-2.2GHZ 0805

12728

C3337J5003AHF

C3337J5003AHF

Anaren

RF DIR COUPLER 3.3-3.7GHZ 0805

0

10616-20

10616-20

Anaren

RF DIR COUPLER 2GHZ-4GHZ

3

DC0710J5020AHF

DC0710J5020AHF

Anaren

RF DIR COUPLER 700MHZ-1GHZ 0805

50377

X3C09P1-03S

X3C09P1-03S

Anaren

RF DIR COUPLER 800MHZ-1GHZ 4SMD

1940

X3C09P2-03S

X3C09P2-03S

Anaren

RF DIR COUPLER 800MHZ-1GHZ 4SMD

229

1F1304-3S

1F1304-3S

Anaren

RF DIR COUPLER 470MHZ-860MHZ SMD

5920

X3C26P1-03S

X3C26P1-03S

Anaren

RF DIR COUPLER 2.3GHZ-2.9GHZ SMD

5905

X3C09E2-20S

X3C09E2-20S

Anaren

RF DIR COUPLER 800MHZ-1GHZ 4SMD

1160

XC2100A-20S

XC2100A-20S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

2078

XC0900E-03S

XC0900E-03S

Anaren

RF DIR COUPLER 800MHZ-1GHZ SMD

0

X3C25P1-04S

X3C25P1-04S

Anaren

RF DIR COUPLER 2.3GHZ-2.7GHZ SMD

0

11303-3

11303-3

Anaren

RF DIR COUPLER 380MHZ-520MHZ SMD

0

XC2100A-30S

XC2100A-30S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

0

XC2100E-10S

XC2100E-10S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

0

X3C25F1-05S

X3C25F1-05S

Anaren

COUPLER DIRECT 2300-2700MHZ

0

XC2100A-03S

XC2100A-03S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

0

X4C20F1-30S

X4C20F1-30S

Anaren

RF DIR COUPLER 1GHZ-3GHZ SMD

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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