RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0402P1880ANTR

CP0402P1880ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P0836ENTR

CP0402P0836ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P0902ENTR

CP0402P0902ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805B2442ASTR

CP0805B2442ASTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XC2100E-10S

XC2100E-10S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

0

CP0603A2100GNTR

CP0603A2100GNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805B0942ASTR\500

CP0805B0942ASTR\500

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC311G7410B-004

LDC311G7410B-004

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

X3C25F1-05S

X3C25F1-05S

Anaren

COUPLER DIRECT 2300-2700MHZ

0

MACP-009945-CH0670

MACP-009945-CH0670

Metelics (MACOM Technology Solutions)

17.5DB COUPLER

2700

CP0402P0902ANTR

CP0402P0902ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1950FLTR\500

CP0603A1950FLTR\500

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402A2442CLTR

CP0402A2442CLTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A2442EWTR

CP0805A2442EWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1907DWTR

CP0603A1907DWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A2442MLTR

CP0603A2442MLTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805B1747ASTR

CP0805B1747ASTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P2442ANTR

CP0402P2442ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402A1747ANTR

CP0402A1747ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XC2100A-03S

XC2100A-03S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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