RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0603D0863BWTR

CP0603D0863BWTR

Elco (AVX)

RF DIR COUPLER 863MHZ 0603

0

BDCN-7-25+

BDCN-7-25+

8.2 DB SMT BI-DIRECTIONAL COUPLE

0

CP0805A2442CWTR

CP0805A2442CWTR

Elco (AVX)

RF DIR COUPLER 2.4-2.484GHZ 0805

0

XC2100A-20S

XC2100A-20S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

2078

ADC-6-10-75+

ADC-6-10-75+

6.6 DB SMT DIRECTIONAL COUPLER,

0

FPC06881

FPC06881

Knowles DLI

RF DIR COUPLER 40GHZ SMD

94

CP0402A1890ELTR

CP0402A1890ELTR

Elco (AVX)

RF DIR COUPLER 1.88-1.9GHZ 0402

0

CP0603A0898ANTR

CP0603A0898ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P1880HNTR

CP0402P1880HNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XC0900E-03S

XC0900E-03S

Anaren

RF DIR COUPLER 800MHZ-1GHZ SMD

0

LDC21881M10B-028

LDC21881M10B-028

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0603A0942BWTR

CP0603A0942BWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A0902DSTR

CP0805A0902DSTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC21836M14D-163

LDC21836M14D-163

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0603A4700GLTR

CP0603A4700GLTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A0947ASTR

CP0805A0947ASTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC181G9513B-320

LDC181G9513B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

EHF-FD1541

EHF-FD1541

Panasonic

RF DIR COUPLER 1.8GHZ-2GHZ 0606

7457

CP0603A1088ENTR

CP0603A1088ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1441BLTR

CP0603A1441BLTR

Elco (AVX)

DIRECTIONAL COUPLER

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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