RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
ADC-8-4-75+

ADC-8-4-75+

7.9 DB SMT DIRECTIONAL COUPLER,

0

CP0603D2442AWTR

CP0603D2442AWTR

Elco (AVX)

RF DIR COUPLER 2.4-2.484GHZ 0603

0

10616-20

10616-20

Anaren

RF DIR COUPLER 2GHZ-4GHZ

3

DC0710J5020AHF

DC0710J5020AHF

Anaren

RF DIR COUPLER 700MHZ-1GHZ 0805

50377

CP0805B1765AWTR

CP0805B1765AWTR

Elco (AVX)

RF DIR COUPLER 1.765GHZ 0805

0

CP20118A-10

CP20118A-10

Amtery Corporation

1 GHZ 18 GHZ, 10 DB COUPLING, B

2

BDCN-14-22+

BDCN-14-22+

13.8 DB SMT BI-DIRECTIONAL COUPL

0

D17W+

D17W+

16-26 DB SMT DIRECTIONAL COUPLER

0

CP0603A0915CLTR

CP0603A0915CLTR

Elco (AVX)

RF DIR COUPLER 915MHZ 0603

0

CP0603A0902BWTR

CP0603A0902BWTR

Elco (AVX)

RF DIR COUPLER 890-915MHZ 0603

0

DBTC-16-5-75L+

DBTC-16-5-75L+

16.3 DB SMT DIRECTIONAL COUPLER,

0

TCD-13-122-75X+

TCD-13-122-75X+

12.7 DB SMT DIRECTIONAL COUPLER,

0

DBTC-6-4-75L+

DBTC-6-4-75L+

6.8 DB SMT DIRECTIONAL COUPLER,

0

CP0402A2140ELTR

CP0402A2140ELTR

Elco (AVX)

RF DIR COUPLER 2.14GHZ 0402

0

CP0805B1907BWTR

CP0805B1907BWTR

Elco (AVX)

RF DIR COUPLR 1.895-1.92GHZ 0805

0

CP0402A1810BNTR

CP0402A1810BNTR

Elco (AVX)

RF DIR COUPLER 1.81GHZ 0402

0

TCD-9-1W-75X+

TCD-9-1W-75X+

8.9 DB SMT DIRECTIONAL COUPLER,

0

X3C09P1-03S

X3C09P1-03S

Anaren

RF DIR COUPLER 800MHZ-1GHZ 4SMD

1940

TCD-10-4-75X+

TCD-10-4-75X+

9.9 DB SMT DIRECTIONAL COUPLER,

0

CP0603V1880BNTR

CP0603V1880BNTR

Elco (AVX)

RF DIR COUPLER 1.85-1.91GHZ 0603

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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