RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0805A0881AWTR

CP0805A0881AWTR

Elco (AVX)

RF DIR COUPLER 869-894MHZ 0805

0

CP0603A1907BWTR

CP0603A1907BWTR

Elco (AVX)

RF DIR COUPLR 1.895-1.92GHZ 0603

0

TCD-13-4X+

TCD-13-4X+

13 DB SMT DIRECTIONAL COUPLER, 5

0

CP0402A5250FLTR

CP0402A5250FLTR

Elco (AVX)

RF DIR COUPLER 5.25GHZ 0402

0

4014C-6

4014C-6

MITEQ, Inc.(L3 Narda-MITEQ)

RF DIR COUPLER 4GHZ-8GHZ MODULE

0

MACP-009011-C80370

MACP-009011-C80370

Metelics (MACOM Technology Solutions)

RF DIR COUPLER 5MHZ-1.2GHZ 6SMD

712

C2023J5003AHF

C2023J5003AHF

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ 0805

32264

JHS-115-PIN

JHS-115-PIN

Metelics (MACOM Technology Solutions)

RF DIR COUPLER 40MHZ-80MHZ SF1

0

CP0603D1890BWTR

CP0603D1890BWTR

Elco (AVX)

RF DIR COUPLER 1.88-1.9GHZ 0603

0

TCD-18-4-75+

TCD-18-4-75+

18 DB SMT DIRECTIONAL COUPLER, 1

0

CP0805B1747CWTR

CP0805B1747CWTR

Elco (AVX)

RF DIR COUPLR 1.71-1.785GHZ 0805

0

CPL-5536-20-29M-79

CPL-5536-20-29M-79

Vitelec / Cinch Connectivity Solutions

2.92MM COUPLER 20 DB 6-40 GHZ

2

CP0402A1880BLTR

CP0402A1880BLTR

Elco (AVX)

RF DIR COUPLER 1.85-1.91GHZ 0402

0

CP0402A6000ELTR

CP0402A6000ELTR

Elco (AVX)

RF DIR COUPLER 6GHZ 0402

0

CPL-5230-10-SMA-79

CPL-5230-10-SMA-79

Vitelec / Cinch Connectivity Solutions

RF DIR COUPLER 500MHZ-18GHZ SMA

4

CP0603A1900ANTR

CP0603A1900ANTR

Elco (AVX)

RF DIR COUPLER 1.9GHZ 0603

0

TCD-16-23-75X+

TCD-16-23-75X+

16.5 DB SMT DIRECTIONAL COUPLER,

0

HH-110-PIN

HH-110-PIN

Metelics (MACOM Technology Solutions)

HYBRID,BROAD-BAND,180_DEG,

25

CP0603A0836CWTR

CP0603A0836CWTR

Elco (AVX)

RF DIR COUPLER 824-849MHZ 0603

0

ADC-20-4-75+

ADC-20-4-75+

19.7 DB SMT DIRECTIONAL COUPLER,

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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