| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
SMT LOW NOISE AMPLIFIER, 50 - 60 |
0 |
|
|
 |
Analog Devices, Inc. |
IC AMP GP 400MHZ-2.2GHZ 16QSOP |
16 |
|
 |
Analog Devices, Inc. |
IC RF AMP LTE 4.8GHZ-6GHZ 16QFN |
217 |
|
 |
Ampleon |
IC RF AMP ISM MODULE |
11 |
|
 |
Renesas Electronics America |
WIDE BAND LOW POWER AMPLIFIER, 1 |
0 |
|
 |
Analog Devices, Inc. |
IC RF AMP RADAR 5GHZ-12GHZ 24QFN |
0 |
|
 |
Maxim Integrated |
IC RF AMP GPS 1575.42MHZ 4WLP |
72937500 |
|
 |
Analog Devices, Inc. |
IC AMP GP 9.5GHZ-11.5GHZ 24SMT |
370 |
|
 |
SMT GAIN BLOCK, DC - 4000 MHZ, 5 |
0 |
|
|
 |
Analog Devices, Inc. |
IC RF AMP GP 9GHZ-12GHZ 32SMT |
155 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 0HZ-43GHZ DIE |
0 |
|
 |
NXP Semiconductors |
IC RF AMP TO270WB-15 |
0 |
|
 |
Skyworks Solutions, Inc. |
IC RF AMP GSM 700MHZ-3.8GHZ 8DFN |
895 |
|
 |
SMT LINEAR AMPLIFIER, 50 - 6000 |
0 |
|
|
 |
Analog Devices, Inc. |
DUAL OUTPUT LOW NOISE AMPLIFIER |
1000 |
|
 |
Metelics (MACOM Technology Solutions) |
IC RF AMP CATV 5MHZ-300MHZ 16QFN |
30917000 |
|
 |
Maxim Integrated |
IC AMP GPS 1575MHZ-1610MHZ 6WLP |
2500 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 17.5GHZ-24GHZ DIE |
18 |
|
 |
Metelics (MACOM Technology Solutions) |
AMPLIFIER,CASCADABLE,THIN FILM |
10 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 5GHZ-20GHZ DIE |
0 |
|
RF/IF amplifiers and RFID amplifiers are critical components in wireless communication systems, designed to boost signal strength while maintaining signal integrity. RF amplifiers operate across radio frequency (RF) and intermediate frequency (IF) bands, enabling signal transmission/reception in devices like base stations, IoT modules, and medical equipment. RFID amplifiers specialize in enhancing signals for radio frequency identification systems, ensuring reliable data exchange between readers and tags. These components are essential for modern technologies such as 5G networks, smart logistics, and contactless payment systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Low Noise Amplifier (LNA) | High sensitivity, minimal added noise | RF receivers, satellite communication |
| Power Amplifier (PA) | High output power, efficiency optimization | Cellular base stations, Wi-Fi routers |
| IF Amplifier | Fixed/dynamic gain control at IF bands | Television tuners, radar systems |
| Variable Gain Amplifier (VGA) | Adjustable gain for signal conditioning | Software-defined radios, test equipment |
| RFID Reader Amplifier | Impedance matching for tag interrogation | UHF RFID readers, NFC terminals |
Typical RF amplifiers consist of: - Dielectric substrate (e.g., FR4, Rogers material) with conductive traces - Transistor elements (GaAs FETs, SiGe BJTs, or GaN HEMTs) - Impedance matching networks (LC circuits or microstrip lines) - Thermal management (heat sinks or thermal vias) - Shielded enclosure for EMI protection Modern designs integrate bias tees, directional couplers, and protection diodes.
| Parameter | Description | Importance |
|---|---|---|
| Gain (dB) | Signal amplification ratio | Determines signal reach and clarity |
| Noise Figure (dB) | Additional noise introduced | Impacts receiver sensitivity |
| Output Power (dBm) | Maximum deliverable power | Dictates transmission distance |
| Frequency Range (GHz) | Operational bandwidth | System compatibility factor |
| P1dB Compression | Linear-to-saturation threshold | Ensures signal fidelity |
| IP3 (dBm) | Intermodulation distortion resistance | Multi-signal environment performance |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | LMX2500 | Integrated synthesizer with 15dBm output power |
| Analog Devices | ADAR1000 | 4-channel mmWave beamformer for 24GHz RFID |
| STMicroelectronics | STRF79X | Highly integrated NFC/RFID transceiver |
| Nordic Semiconductor | nRF21540 | 2.4GHz front-end module with +20dB gain |
| Impinj | R4H001 | UHF Gen2 RFID reader IC with on-chip amplifier |
Key considerations include: - Frequency alignment with system requirements - Gain flatness across operational bandwidth - Thermal dissipation capabilities - Package type (QFN, BGA, or connectorized) - Environmental compliance (temperature, humidity) - Cost vs. performance trade-offs
Emerging trends include: - Transition to GaN technology for higher power density - Silicon integration for mmWave applications - AI-driven dynamic impedance matching - Energy-efficient Class-J and Doherty architectures - Convergence with photonic ICs for 6G systems