Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	ORNTA5002DT1 Vishay	RES ARRAY 4 RES 50K OHM 8SOIC	0
	MPMT5001BT1 Vishay	RES NTWRK 2 RES 2.5K OHM TO236-3	0
	ORNTV50015002T3 Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	ORNV50021002UF Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	ORNV25025001UF Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	ORNTV50011002T0 Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	VSSR1601472GTF Vishay	RES ARRAY 15 RES 4.7K OHM 16SSOP	0
	VSSR1601101GUF Vishay	RES ARRAY 15 RES 100 OHM 16SSOP	0
	MPMT1003CT1 Vishay	RES NTWRK 2 RES 50K OHM TO236-3	0
	VSSR2001103JTF Vishay	RES ARRAY 19 RES 10K OHM 20SSOP	0
	OSOPA5002AT1 Vishay	RES ARRAY 10 RES 50K OHM 20SSOP	0
	ORNV50022002UF Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	MPMT10012002CT1 Vishay	RES NTWRK 2 RES MULT OHM TO236-3	0
	VSSR2001152GTF Vishay	RES ARRAY 19 RES 1.5K OHM 20SSOP	0
	MORNTA2502AT5 Vishay	RES ARRAY 4 RES 25K OHM 8TSSOP	0
	ORNV50022502T5 Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	ORNTV25022502T1 Vishay	RES NETWORK 5 RES 25K OHM 8SOIC	0
	ORNTV50025001TS Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
	MPMT4001BT1 Vishay	RES NETWORK 2 RES 2K OHM TO236-3	0
	ORNTV10025001TF Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages