Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC10A012K00GEK Vishay / Dale	RES ARRAY 9 RES 2K OHM 10SIP	0
CSC06A01120KGPA Vishay / Dale	RES ARRAY 5 RES 120K OHM 6SIP	0
SOMC160368K0GEA Vishay / Dale	RES ARRAY 8 RES 68K OHM 16SOIC	0
CSC06A031K00GPA Vishay / Dale	RES ARRAY 3 RES 1K OHM 6SIP	0
SOMC1603560RGEA Vishay / Dale	RES ARRAY 8 RES 560 OHM 16SOIC	0
MDP14032K70GE04 Vishay / Dale	RES ARRAY 7 RES 2.7K OHM 14DIP	0
MSP08A01100RGEJ Vishay / Dale	RES ARRAY 7 RES 100 OHM 8SIP	0
M8340109K1002GCD03 Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	236
CSC10A01330RGPA Vishay / Dale	RES ARRAY 9 RES 330 OHM 10SIP	0
CSC08A0320K0GPA Vishay / Dale	RES ARRAY 4 RES 20K OHM 8SIP	0
CRA06S04339R0JTA Vishay / Dale	RES ARRAY 2 RES 39 OHM 0606	0
CRA06S08330K0JTA Vishay / Dale	RES ARRAY 4 RES 30K OHM 1206	812
MDP140310K0GE04 Vishay / Dale	RES ARRAY 7 RES 10K OHM 14DIP	0
CSC10A03100KGEK Vishay / Dale	RES ARRAY 5 RES 100K OHM 10SIP	0
CSC08A03330RGPA Vishay / Dale	RES ARRAY 4 RES 330 OHM 8SIP	0
CSC10A011K50GEK Vishay / Dale	RES ARRAY 9 RES 1.5K OHM 10SIP	51
MSP08A0182K0GEJ Vishay / Dale	RES ARRAY 7 RES 82K OHM 8SIP	0
CSC08A032K00GPA Vishay / Dale	RES ARRAY 4 RES 2K OHM 8SIP	0
CSC04A0156K0GPA Vishay / Dale	RES ARRAY 3 RES 56K OHM 4SIP	0
CRA06P08375K0JTA Vishay / Dale	RES ARRAY 4 RES 75K OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages