Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC08A0310K0FPA Vishay / Dale	RES ARRAY 4 RES 10K OHM 8SIP	0
CRASA49K9F1K02TA Vishay / Dale	RES ARRAY 4 RES MULT OHM 0612	90
MSP08A03220RGEJ Vishay / Dale	RES ARRAY 4 RES 220 OHM 8SIP	0
M8340109K2202GCD03 Vishay / Dale	RES ARRAY 9 RES 22K OHM 10SIP	0
CRA06S04324R0JTA Vishay / Dale	RES ARRAY 2 RES 24 OHM 0606	0
MSP08A0322K0GEJ Vishay / Dale	RES ARRAY 4 RES 22K OHM 8SIP	0
CRA06S0838K20JTA Vishay / Dale	RES ARRAY 4 RES 8.2K OHM 1206	375
CRA06S083360RJTA Vishay / Dale	RES ARRAY 4 RES 360 OHM 1206	4114
CSC08A01510RGPA Vishay / Dale	RES ARRAY 7 RES 510 OHM 8SIP	0
MSP08A032K70FEJ Vishay / Dale	RES ARRAY 4 RES 2.7K OHM 8SIP	0
CSC11B014K70GPA Vishay / Dale	RES ARRAY 10 RES 4.7K OHM 11SIP	0
CRA06S083330RJTA Vishay / Dale	RES ARRAY 4 RES 330 OHM 1206	11522
CRA06P083160RJTA Vishay / Dale	RES ARRAY 4 RES 160 OHM 1206	0
MDP160327R0GE04 Vishay / Dale	RES ARRAY 8 RES 27 OHM 16DIP	0
CRA06P08382R0JTA Vishay / Dale	RES ARRAY 4 RES 82 OHM 1206	0
CSC09A011K00FEK Vishay / Dale	RES ARRAY 8 RES 1K OHM 9SIP	6162
MSP08C0382K0GEJ Vishay / Dale	RES ARRAY 4 RES 82K OHM 8SIP	0
CSC10A01680RGEK Vishay / Dale	RES ARRAY 9 RES 680 OHM 10SIP	0
SOMC140310K0GEA Vishay / Dale	RES ARRAY 7 RES 10K OHM 14SOIC	0
CRA06S04330R0JTA Vishay / Dale	RES ARRAY 2 RES 30 OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages