Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC10A01680RGPA Vishay / Dale	RES ARRAY 9 RES 680 OHM 10SIP	0
CRA06P0833K60JTA Vishay / Dale	RES ARRAY 4 RES 3.6K OHM 1206	0
MDP160382R0GE04 Vishay / Dale	RES ARRAY 8 RES 82 OHM 16DIP	0
CRA06P0831M00JTA Vishay / Dale	RES ARRAY 4 RES 1M OHM 1206	860
MSP06A01160RGEJ Vishay / Dale	RES ARRAY 5 RES 160 OHM 6SIP	0
CRA06P083430KJTA Vishay / Dale	RES ARRAY 4 RES 430K OHM 1206	0
MDP14014K30GE04 Vishay / Dale	RES ARRAY 13 RES 4.3K OHM 14DIP	0
CRA04P0830000ZTD Vishay / Dale	RES ARRAY 4 RES ZERO OHM 0804	4768
MDP160327K0GE04 Vishay / Dale	RES ARRAY 8 RES 27K OHM 16DIP	0
CRA12E083150RJTR Vishay / Dale	RES ARRAY 4 RES 150 OHM 2012	0
CSC09A01100KGEK Vishay / Dale	RES ARRAY 8 RES 100K OHM 9SIP	2739
CSC06A0120K0GPA Vishay / Dale	RES ARRAY 5 RES 20K OHM 6SIP	0
SOMC160110K0JEA Vishay / Dale	RES ARRAY 15 RES 10K OHM 16SOIC	3204
SOMC140310K0FEA Vishay / Dale	RES ARRAY 7 RES 10K OHM 14SOIC	0
MSP08A034K70GEJ Vishay / Dale	RES ARRAY 4 RES 4.7K OHM 8SIP	0
MSP08A0368R0GEJ Vishay / Dale	RES ARRAY 4 RES 68 OHM 8SIP	0
SOMC16032K20GEA Vishay / Dale	RES ARRAY 8 RES 2.2K OHM 16SOIC	16
CSC08A03220RGEK Vishay / Dale	RES ARRAY 4 RES 220 OHM 8SIP	0
CRA12E08310R0JTR Vishay / Dale	RES ARRAY 4 RES 10 OHM 2012	88
CSC08A01270RGPA Vishay / Dale	RES ARRAY 7 RES 270 OHM 8SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages