Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
742C0431002FP CTS Corporation	RES ARRAY 2 RES 10K OHM 0606	0
745C101471JP CTS Corporation	RES ARRAY 8 RES 470 OHM 2512	2780
77061153P CTS Corporation	RES ARRAY 5 RES 15K OHM 6SIP	0
766143101GP CTS Corporation	RES ARRAY 7 RES 100 OHM 14SOIC	0
742C08356R0FP CTS Corporation	RES ARRAY 4 RES 56 OHM 1206	0
766163564GPTR13 CTS Corporation	RES ARRAY 8 RES 560K OHM 16SOIC	0
768163391GP CTS Corporation	RES ARRAY 8 RES 390 OHM 16SOIC	0
766161270GPTR13 CTS Corporation	RES ARRAY 15 RES 27 OHM 16SOIC	0
767143273GP CTS Corporation	RES ARRAY 7 RES 27K OHM 14SOIC	0
767163204GPTR13 CTS Corporation	RES ARRAY 8 RES 200K OHM 16SOIC	0
767141750GP CTS Corporation	RES ARRAY 13 RES 75 OHM 14SOIC	0
767161102GPTR13 CTS Corporation	RES ARRAY 15 RES 1K OHM 16SOIC	0
753101103GPTR7 CTS Corporation	RES ARRAY 9 RES 10K OHM 10SRT	994
753163471GP CTS Corporation	RES ARRAY 8 RES 470 OHM 16DRT	0
752091330GP CTS Corporation	RES ARRAY 8 RES 33 OHM 9SRT	0
741X163102JP CTS Corporation	RES ARRAY 8 RES 1K OHM 1506	3143
742C083150JP CTS Corporation	RES ARRAY 4 RES 15 OHM 1206	0
741C083512JP CTS Corporation	RES ARRAY 4 RES 5.1K OHM 0804	0
767161122GP CTS Corporation	RES ARRAY 15 RES 1.2K OHM 16SOIC	0
766163223GP CTS Corporation	RES ARRAY 8 RES 22K OHM 16SOIC	1234

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages