Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
766163111GP CTS Corporation	RES ARRAY 8 RES 110 OHM 16SOIC	0
752161103GP CTS Corporation	RES ARRAY 14 RES 10K OHM 16DRT	0
767141473GP CTS Corporation	RES ARRAY 13 RES 47K OHM 14SOIC	1467
741X163391JP CTS Corporation	RES ARRAY 8 RES 390 OHM 1506	0
752181103GP CTS Corporation	RES ARRAY 16 RES 10K OHM 18DRT	0
766141680GPTR13 CTS Corporation	RES ARRAY 13 RES 68 OHM 14SOIC	0
742C083200JP CTS Corporation	RES ARRAY 4 RES 20 OHM 1206	0
766163154GPTR7 CTS Corporation	RES ARRAY 8 RES 150K OHM 16SOIC	0
768161564GP CTS Corporation	RES ARRAY 15 RES 560K OHM 16SOIC	0
767141271GP CTS Corporation	RES ARRAY 13 RES 270 OHM 14SOIC	0
741X083220JP CTS Corporation	RES ARRAY 4 RES 22 OHM 0804	125704
770101123P CTS Corporation	RES ARRAY 9 RES 12K OHM 10SIP	0
768163684GPTR13 CTS Corporation	RES ARRAY 8 RES 680K OHM 16SOIC	0
742C043100JP CTS Corporation	RES ARRAY 2 RES 10 OHM 0606	0
745C101332JP CTS Corporation	RES ARRAY 8 RES 3.3K OHM 2512	2268
766143473GP CTS Corporation	RES ARRAY 7 RES 47K OHM 14SOIC	0
766161222GPTR7 CTS Corporation	RES ARRAY 15 RES 2.2K OHM 16SOIC	0
741C083183JP CTS Corporation	RES ARRAY 4 RES 18K OHM 0804	0
742C0434023FP CTS Corporation	RES ARRAY 2 RES 402K OHM 0606	0
767163823GP CTS Corporation	RES ARRAY 8 RES 82K OHM 16SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages