Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
LT5400BHMS8E-6#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	0
MAX5492RA01100 Analog Devices, Inc.	MATCHED RESISTOR-DIVIDER	1740
LT5400AHMS8E-3#PBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	0
LT5400BMPMS8E-7#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	0
MAX5490MB02000 Analog Devices, Inc.	MATCHED RESISTOR-DIVIDER NETWORK	3194
MAX5491VA10000+ Analog Devices, Inc.	MAX5491 PRECISION-MATCHED RESIST	889
LT5400BIMS8E-6#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	0
LT5401AIMSE#TRPBF Analog Devices, Inc.	MATCHED PRECISION RESISTOR NETWO	0
LT5400BCMS8E-3#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	0
LT5400BCMS8E-5#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES 1M OHM 8TSSOP	0
MAX5491RA02500-T Analog Devices, Inc.	MATCHED RESISTOR-DIVIDER	7500
LT5400BIMS8E-4#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES 1K OHM 8TSSOP	2432
LT5400BCMS8E-7#PBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	454
LT5400BIMS8E-7#PBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	688
LT5400BCMS8E-2#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES 100K OHM 8TSSOP	0
MAX5492MA03200 Analog Devices, Inc.	MATCHED RESISTOR-DIVIDER	2284
LT5400BCMS8E-6#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	2825
LT5400BIMS8E-8#PBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	255
LT5400BMPMS8E-2#PBF Analog Devices, Inc.	RES ARRAY 4 RES 100K OHM 8TSSOP	49
LT5400BHMS8E-3#TRPBF Analog Devices, Inc.	RES ARRAY 4 RES MULT OHM 8TSSOP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages