Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	YC162-FR-0743K2L Yageo	RES ARRAY 2 RES 43.2K OHM 0606	0
	AF164-FR-07464RL Yageo	RES ARRAY 4 RES 464 OHM 1206	0
	AF162-JR-07360RL Yageo	RES ARRAY 2 RES 360 OHM 0606	0
	YC324-FK-0769K8L Yageo	RES ARRAY 4 RES 69.8K OHM 2012	0
	AF164-FR-07191KL Yageo	RES ARRAY 4 RES 191K OHM 1206	0
	TC164-FR-07549KL Yageo	RES ARRAY 4 RES 549K OHM 1206	0
	TC124-FR-07845KL Yageo	RES ARRAY 4 RES 845K OHM 0804	0
	YC162-JR-0739KL Yageo	RES ARRAY 2 RES 39K OHM 0606	0
	TC164-FR-07133RL Yageo	RES ARRAY 4 RES 133 OHM 1206	0
	AF164-JR-072K2L Yageo	RES ARRAY 4 RES 2.2K OHM 1206	0
	YC124-FR-0724KL Yageo	RES ARRAY 4 RES 24K OHM 0804	0
	YC248-JR-0736KL Yageo	RES ARRAY 8 RES 36K OHM 1606	0
	YC162-FR-07487KL Yageo	RES ARRAY 2 RES 487K OHM 0606	0
	YC124-FR-07750RL Yageo	RES ARRAY 4 RES 750 OHM 0804	0
	AF164-FR-0766R5L Yageo	RES ARRAY 4 RES 66.5 OHM 1206	0
	YC162-FR-0721R5L Yageo	RES ARRAY 2 RES 21.5 OHM 0606	0
	TC124-FR-071K3L Yageo	RES ARRAY 4 RES 1.3K OHM 0804	0
	TC124-FR-0756R2L Yageo	RES ARRAY 4 RES 56.2 OHM 0804	0
	TC164-FR-074K12L Yageo	RES ARRAY 4 RES 4.12K OHM 1206	0
	YC248-FR-07110KL Yageo	RES ARRAY 8 RES 110K OHM 1606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages