Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
AF164-FR-075K11L Yageo	RES ARRAY 4 RES 5.11K OHM 1206	0
AF164-FR-07261RL Yageo	RES ARRAY 4 RES 261 OHM 1206	0
AF164-FR-0751K1L Yageo	RES ARRAY 4 RES 51.1K OHM 1206	0
TC164-FR-07137RL Yageo	RES ARRAY 4 RES 137 OHM 1206	0
TC164-FR-0736K5L Yageo	RES ARRAY 4 RES 36.5K OHM 1206	0
AF162-JR-0782RL Yageo	RES ARRAY 2 RES 82 OHM 0606	0
YC164-FR-07120KL Yageo	RES ARRAY 4 RES 120K OHM 1206	0
AF164-FR-075K36L Yageo	RES ARRAY 4 RES 5.36K OHM 1206	0
YC124-JR-072R2L Yageo	RES ARRAY 4 RES 2.2 OHM 0804	0
YC162-FR-0754K9L Yageo	RES ARRAY 2 RES 54.9K OHM 0606	0
YC164-JR-0768RL Yageo	RES ARRAY 4 RES 68 OHM 1206	5504
YC324-FK-071K47L Yageo	RES ARRAY 4 RES 1.47K OHM 2012	0
AF164-FR-074K32L Yageo	RES ARRAY 4 RES 4.32K OHM 1206	0
TC164-FR-07750KL Yageo	RES ARRAY 4 RES 750K OHM 1206	0
YC162-FR-07287KL Yageo	RES ARRAY 2 RES 287K OHM 0606	0
YC164-JR-07820RL Yageo	RES ARRAY 4 RES 820 OHM 1206	7620
TC164-FR-07453RL Yageo	RES ARRAY 4 RES 453 OHM 1206	0
YC324-FK-07280KL Yageo	RES ARRAY 4 RES 280K OHM 2012	0
YC164-FR-0736KL Yageo	RES ARRAY 4 RES 36K OHM 1206	0
YC162-FR-078K25L Yageo	RES ARRAY 2 RES 8.25K OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages