Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	MU20K00/20K00BQL VPG Foil	MU20K00/20K00BQL REELED	0
	Y1767V0009FB9L VPG Foil	RES NETWORK 2 RES 20K OHM RADIAL	0
	Y1691V0167BT0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y0115V0607TT9L VPG Foil	VFD244ZT 4K/40K TCR0.2 T T B	0
	Y0076V0410QT9L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y4942V0131TT0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y0006V0003VT0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y1691V0432VV9L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y5076V0056BA0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y1485V0608QT49W VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
	Y1692V0166BB0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y5076V0071VV0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y1685V0001TT49R VPG Foil	VFCD1505 10K/10K T T S T 157286	0
	Y4485V0073QT9L VPG Foil	DSMZ 1K/100R TCR0.2 Q T S B	0
	Y4485V0616BA9W VPG Foil	DSMZ 8K7/300R TCR0.2 B A S W	0
	Y0115V0681VV0L VPG Foil	VFD244Z 880R0/570R TCR0.2 V V B	0
	SLD1X30K00AQ VPG Foil	SLD1X30K00AQ 5 PPM NETWORK	0
	Y5076V0002BA9L VPG Foil	VHD200T 5K/5K B A	0
	Y1485V0004BT0R VPG Foil	RES NETWORK 2 RES 1K OHM 1610	0
	Y5076V0266VV0L VPG Foil	VHD200 13K/1K V V	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages