Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	Y0076V0004VV9L VPG Foil	RES NETWORK 2 RES 1K OHM RADIAL	0
	Y1691V0169BB9L VPG Foil	300144ZT 1K/13K B B	0
	Y1691V0010BA0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y4942V0053FF0L VPG Foil	RES NTWRK 2 RES 12K OHM RADIAL	0
	Y1485V0259AT9R VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
	Y4485V0640BQ9W VPG Foil	DSMZ 250R/250R TCR0.2 B Q S W	0
	Y0006V0002QT0L VPG Foil	RES NETWORK 2 RES 5K OHM RADIAL	0
	Y0076V0058BQ0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y1691V0366BQ0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y1720V0686BB9L VPG Foil	300199ZT 100K/100K/ 100K/5K B B	0
	Y4485V0005BA9W VPG Foil	DSMZ 5K/10K TCR0.2 B A S W	0
	SM2Y2K000/18K00BA VPG Foil	SM2Y2K000/18K00BA 2.5 PPM NETWOR	0
	Y1485V0618BA9L VPG Foil	DSM 5K9/10K TCR2 B A S B	0
	Y0094V0103QT0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y0035V0509QT0L VPG Foil	RES NETWORK 4 RES MULT OHM AXIAL	0
	Y1713V0654AA9L VPG Foil	300192ZT 10K/100K/100K A A	0
	Y1691V0121TT0L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y4951V0286TT9L VPG Foil	RES NTWRK 4 RES MULT OHM RADIAL	0
	Y5076V0056AA9L VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	SLD2X2K000/20K00BA VPG Foil	SLD2X2K000/20K00BA 5 PPM NETWORK	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages