Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	Y1747V0360QT9R VPG Foil	RES ARRAY 4 RES 2.5K OHM 8SOIC	0
	Y1365V0023QT9R VPG Foil	RES ARRAY 4 RES 500 OHM 8SOIC	0
	Y4485V0083BT0R VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
	Y4485V0001BT0L VPG Foil	RES NETWORK 2 RES 10K OHM 1610	0
	Y1365V0204QT0U VPG Foil	RES ARRAY 4 RES MULT OHM 8SOIC	0
	Y0006V0100 TT0L (20K/2K) VPG Foil	RES NTWRK 2 RES MULT OHM RADIAL	0
	Y1365V0019AT0W VPG Foil	RES ARRAY 4 RES 5K OHM 8SOIC	0
	Y1365V0019QT9W VPG Foil	RES ARRAY 4 RES 5K OHM 8SOIC	0
	Y1365V0196BT0R VPG Foil	RES ARRAY 4 RES MULT OHM 8SOIC	0
	Y1365V0175BQ9L VPG Foil	RES ARRAY 4 RES MULT OHM 8SOIC	0
	Y4485V0002QT9W VPG Foil	RES NETWORK 2 RES 5K OHM 1610	0
	Y1685V0059QQ9R VPG Foil	RES NETWORK 2 RES 2K OHM 1505	0
	Y1685V0001AA0W VPG Foil	RES NETWORK 2 RES 10K OHM 1505	0
	Y1365V0023QT9U VPG Foil	RES ARRAY 4 RES 500 OHM 8SOIC	0
	Y1747V0008QT0W VPG Foil	RES ARRAY 4 RES 10K OHM 8SOIC	0
	Y4485V0558QT9R VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
	Y1365V0206QT0U VPG Foil	RES ARRAY 4 RES MULT OHM 8SOIC	0
	Y4485V0076BQ9W VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
	Y1747V0019QT0U VPG Foil	RES ARRAY 4 RES 5K OHM 8SOIC	0
	Y1747V0019BT0W VPG Foil	RES ARRAY 4 RES 5K OHM 8SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages