Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CN-41JL6---22R Viking Tech	22R 5% ARRAY CONVEX 0502	220000
CN-21JL6---47R Viking Tech	47 R OHM 5% RESISTOR NETWORK/ARR	450000
AS42JTF0330 Viking Tech	33 R OHM 5% ANTI-SULFURATED ARRA	600000
AS42JTF0100 Viking Tech	10 R OHM 5% ANTI-SULFURATED ARRA	380000
CN-43JL7---22R Viking Tech	22 R OHM 5% RESISTOR NETWORK/ARR	2145000
CN-42JL6---10R Viking Tech	10 R OHM 5% RESISTOR NETWORK/ARR	30000
CN-43FL7--680R Viking Tech	0603*4 1% ARRAY CONVEX 680R	0
CN-43FL7--4K53 Viking Tech	0603*4 1% ARRAY CONVEX 4K53	0
AS42JTF0180 Viking Tech	18 R OHM 5% ANTI-SULFURATED ARRA	60000
CN-42FL6----1K Viking Tech	1 K OHM 1% RESISTOR NETWORK/ARRA	80000
CN-43FLA----1K Viking Tech	0603*4 1% ARRAY CONVEX 1K	0
CN-43JA7---1K5 Viking Tech	0603*4 5% ARRAY CONVEX 1K5	0
AS42JTF0300 Viking Tech	30 R OHM 5% ANTI-SULFURATED ARRA	40000
CN-42JL6---30R Viking Tech	30 R OHM 5% RESISTOR NETWORK/ARR	180000
AS21JTF0470 Viking Tech	0201*2 5% ANTI-SULF SMD 47R	0
AS21JTF0390 Viking Tech	0201*2 5% ANTI-SULF SMD 39R	0
AS41JTF0220 Viking Tech	0201*4 5% ANTI-SULF SMD 22R	0
AS41JTF0390 Viking Tech	0201*4 5% ANTI-SULF SMD 39R	0
AS41JTF0470 Viking Tech	0201*4 5% ANTI-SULF SMD 47R	0
AS21JTF0360 Viking Tech	0201*2 5% ANTI-SULF SMD 36R	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages