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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DJT120K

RAVF164DJT120K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 120K OHM 1206

0
RAVF164DJT1K80

RAVF164DJT1K80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.8K OHM 1206

0
RAVF164DJT510K

RAVF164DJT510K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 510K OHM 1206

0
RAVF164DFT13R0

RAVF164DFT13R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 13 OHM 1206

0
RAVF164DFT12R0

RAVF164DFT12R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 12 OHM 1206

0
RAVF104DJT1R20

RAVF104DJT1R20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.2 OHM 0804

0
RAVF164DFT18R0

RAVF164DFT18R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 18 OHM 1206

0
RAVF164DFT2K70

RAVF164DFT2K70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.7K OHM 1206

0
RAVF104DJT620R

RAVF104DJT620R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 620 OHM 0804

0
RAVF164DJT1R00

RAVF164DJT1R00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1 OHM 1206

0
RAVF164DJT33R0

RAVF164DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33 OHM 1206

4767
RAVF164DJT6K80

RAVF164DJT6K80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.8K OHM 1206

0
RAVF104DJT18K0

RAVF104DJT18K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 18K OHM 0804

0
RAVF164DJT100K

RAVF164DJT100K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100K OHM 1206

118005000
RAVF164DJT30K0

RAVF164DJT30K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 30K OHM 1206

0
RAVF104DFT62R0

RAVF104DFT62R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 62 OHM 0804

0
RAVF164DFT470K

RAVF164DFT470K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470K OHM 1206

0
RAVF164DFT56R2

RAVF164DFT56R2

Stackpole Electronics, Inc.

RES ARRAY 4 RES 56.2 OHM 1206

0
RAVF104DFT820R

RAVF104DFT820R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 820 OHM 0804

0
RAVF164DJT1R30

RAVF164DJT1R30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.3 OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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