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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF102DJT9K10

RAVF102DJT9K10

Stackpole Electronics, Inc.

RES ARRAY 2 RES 9.1K OHM 0404

0
RAVF168DJT100K

RAVF168DJT100K

Stackpole Electronics, Inc.

RES ARRAY 8 RES 100K OHM 1506

0
RAVF164DFT680K

RAVF164DFT680K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 680K OHM 1206

0
RAVF164DJT390K

RAVF164DJT390K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 390K OHM 1206

0
RAVF164DFT62K0

RAVF164DFT62K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 62K OHM 1206

0
RAVF168DJT10K0

RAVF168DJT10K0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 10K OHM 1506

0
RAVF164DJT10K0

RAVF164DJT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 1206

163
RAVF162DJT10K0

RAVF162DJT10K0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 10K OHM 0606

0
RAVF104DJT760K

RAVF104DJT760K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 760K OHM 0804

0
RAVF104DJT100R

RAVF104DJT100R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100 OHM 0804

0
RAVF324DJT13R0

RAVF324DJT13R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 13 OHM 2012

0
RAVF164DJT9K10

RAVF164DJT9K10

Stackpole Electronics, Inc.

RES ARRAY 4 RES 9.1K OHM 1206

0
RAVF164DJT76K0

RAVF164DJT76K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 76K OHM 1206

0
RAVF164DFT24R0

RAVF164DFT24R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 24 OHM 1206

0
RAVF164DFT1M00

RAVF164DFT1M00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1M OHM 1206

0
RAVF164DJT300R

RAVF164DJT300R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 300 OHM 1206

0
RAVF162DJT300R

RAVF162DJT300R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 300 OHM 0606

0
RAVF104DJT270R

RAVF104DJT270R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270 OHM 0804

0
RAVF164DFT33R0

RAVF164DFT33R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33 OHM 1206

0
RAVF164DFT30K0

RAVF164DFT30K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 30K OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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