Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	RP104PJ1R0CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X4R	0
	RPS164PJ100CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0603X4R	0
	RP164PJ105CS Samsung Electro-Mechanics	RES ARRAY 4 RES 1M OHM 1206	0
	RPS164PJ114CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0603X4R	0
	RPS164PJ473CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0603X4R	0
	RP102PJ473CS Samsung Electro-Mechanics	RES ARRAY 2 RES 47K OHM 0404	0
	RPS104PJ431CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X4R	0
	RPS104PJ2R7CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X4R	0
	RP102PJ512CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X2R	0
	RP102PJ161CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X2R	0
	RP102PJ180CS Samsung Electro-Mechanics	RES ARRAY 2 RES 18 OHM 0404	0
	RPS102PJ3R9CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X2R	0
	RPS164PJ304CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0603X4R	0
	RP102PJ132CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X2R	0
	RPS104PJ8R2CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X4R	0
	RPS164PJ561CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0603X4R	0
	RP102PJ241CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X2R	0
	RPS164PJ274CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0603X4R	0
	RP104PJ241CS Samsung Electro-Mechanics	RES ARRAY 4 RES 240 OHM 0804	0
	RPS104PJ561CS Samsung Electro-Mechanics	RESISTOR ARRAY CONVEX 0402X4R	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages